By Toshiba Semiconductor and Storage 86
Toshiba’s dual-sided cooling MOSFETs have a heat sink on both sides of the package to improve heat dissipation, making it possible to realize high-current operations in compact packages. These MOSFETs share the same 5 mm x 6 mm footprint as Toshiba’s current SOP Advance package, facilitating replacement with any need to modify existing PCB layouts.