 | | | |
| PartNumber | ECB24 | ECB240ABBCN-Y3 | ECB240ABCCN-Y3 |
| Description | LPDDR2 2G DIE 64MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB240ABBCN-Y3) | IC LPDDR2 1.2V DIE-COM | |
| Manufacturer | Micron Technology Inc. | - | - |
| Product Category | Memory | - | - |
| Series | * | - | - |
| Packaging | - | - | - |
| Package Case | - | - | - |
| Operating Temperature | - | - | - |
| Interface | - | - | - |
| Voltage Supply | - | - | - |
| Supplier Device Package | - | - | - |
| Memory Size | - | - | - |
| Memory Type | - | - | - |
| Speed | - | - | - |
| Format Memory | - | - | - |
| Fabricante | Parte # | Descripción | RFQ |
|---|---|---|---|
| ECB24 | Nuevo y original | ||
| ECB240ABBCN-Y3 | LPDDR2 2G DIE 64MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB240ABBCN-Y3) | ||
Micron |
ECB240ABCCN-Y3 | IC LPDDR2 1.2V DIE-COM |