 | | | |
| PartNumber | ECB206.7458MTR | ECB24 | ECB240ABBCN-Y3 |
| Description | LPDDR2 2G DIE 64MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB240ABBCN-Y3) | ||
| Manufacturer | - | Micron Technology Inc. | - |
| Product Category | - | Memory | - |
| Series | - | * | - |
| Packaging | - | - | - |
| Package Case | - | - | - |
| Operating Temperature | - | - | - |
| Interface | - | - | - |
| Voltage Supply | - | - | - |
| Supplier Device Package | - | - | - |
| Memory Size | - | - | - |
| Memory Type | - | - | - |
| Speed | - | - | - |
| Format Memory | - | - | - |
| Fabricante | Parte # | Descripción | RFQ |
|---|---|---|---|
| ECB206.7458MTR | Nuevo y original | ||
| ECB24 | Nuevo y original | ||
| ECB240ABBCN-Y3 | LPDDR2 2G DIE 64MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB240ABBCN-Y3) | ||
| ECB28 | End Cap, Nominal Conduit Size 28mm, Acetal (POM), Black | ||
| ECB2F40 | Nuevo y original | ||
| ECB2F40 FLASH | Nuevo y original | ||
| ECB2F40FLASH | Nuevo y original | ||
Micron |
ECB240ABCCN-Y3 | IC LPDDR2 1.2V DIE-COM |