ECF840AAACN-C2-Y3

ECF840AAACN-C2-Y3
Mfr. #:
ECF840AAACN-C2-Y3
Fabricante:
Micron
Descripción:
IC DRAM 8G PARALLEL
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
ECF840AAACN-C2-Y3 Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Más información:
ECF840AAACN-C2-Y3 más información ECF840AAACN-C2-Y3 Product Details
Atributo del producto
Valor de atributo
Tags
ECF84, ECF8, ECF
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
    H***i
    H***i
    SA

    It is really good commodity and compatible with description

    2019-04-17
    S***v
    S***v
    RU

    It took a long time, but everything is fine! Came directly to the mailbox :)

    2019-04-14
    I***v
    I***v
    BG

    Very fast shipping.I reccomendThak you

    2019-04-15
    I***i
    I***i
    KZ

    good

    2019-04-19
***et
LPDDR3 256MX32 DIE-COM 1.2V WIRELESS TEMP
***i-Key
IC SDRAM LPDDR3 8G 256MX32
Parte # Mfg. Descripción Valores Precio
ECF840AAACN-C2-Y3
DISTI # ECF840AAACN-C2-Y3-ND
Micron Technology IncIC DRAM 8G PARALLEL
RoHS: Compliant
Min Qty: 1
Container: Bulk
Limited Supply - Call
    ECF840AAACN-C2-Y3-ES
    DISTI # ECF840AAACN-C2-Y3-ES
    Micron Technology IncLPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C2-Y3-ES)
    RoHS: Compliant
    Min Qty: 1
    Container: Waffle Pack
    Americas - 0
      ECF840AAACN-C2-Y3
      DISTI # 340-293525
      Micron Technology IncDRAM LPDDR3 8G Die 256MX32
      RoHS: Compliant
      0
        Imagen Parte # Descripción
        ECF840AAACN-C1-Y3

        Mfr.#: ECF840AAACN-C1-Y3

        OMO.#: OMO-ECF840AAACN-C1-Y3

        DRAM LPDDR3 8G Die 256MX32
        ECF840AAACN-C1-Y3

        Mfr.#: ECF840AAACN-C1-Y3

        OMO.#: OMO-ECF840AAACN-C1-Y3-MICRON-TECHNOLOGY

        IC DRAM 8G PARALLEL
        ECF840AAACN-C2-Y3

        Mfr.#: ECF840AAACN-C2-Y3

        OMO.#: OMO-ECF840AAACN-C2-Y3-MICRON-TECHNOLOGY

        IC DRAM 8G PARALLEL
        ECF840AAACN-Y3

        Mfr.#: ECF840AAACN-Y3

        OMO.#: OMO-ECF840AAACN-Y3-1190

        LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-Y3)
        Disponibilidad
        Valores:
        Available
        En orden:
        3500
        Ingrese la cantidad:
        El precio actual de ECF840AAACN-C2-Y3 es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
        Precio de referencia (USD)
        Cantidad
        Precio unitario
        Ext. Precio
        1
        0,00 US$
        0,00 US$
        10
        0,00 US$
        0,00 US$
        100
        0,00 US$
        0,00 US$
        500
        0,00 US$
        0,00 US$
        1000
        0,00 US$
        0,00 US$
        Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
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