We guarantee 100% customer satisfaction.
Quality GuaranteesWe provide 90-360 days warranty.
If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.
we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.
Email: [email protected]
Fast shipping. Excellent packaging. Exact description. Good price. The seller and the store is satisfied. I recommend.
2019-04-09
It took me a long time to get there but finally today came and all good, i guess it's about mail handling, thanks.
2019-07-19
Excellent seller, fast shipment, delivery to ukraine ukrmail from the moment of order 37 days,.-Ordered from the seller one parcel 9 positions, the parcel was not tracked and in the end, i was handed to the cut parcel and postmen immediately in the cold-this is a type of customs opened, although there were no signs of customs about the autopsy, in short i realized it was opened in the post office, but since small leds are not interesting to any of the postmen, Then all positions remained in place.-So everything came... everything is in place ..... but the sediment from ukrpost is sloppy left.
2019-06-12| Parte # | Mfg. | Descripción | Valores | Precio |
|---|---|---|---|---|
| ECF840AAACN-C1-Y3 DISTI # ECF840AAACN-C1-Y3-ND | Micron Technology Inc | IC DRAM 8G PARALLEL RoHS: Compliant Min Qty: 1 Container: Bulk | Limited Supply - Call | |
| ECF840AAACN-C1-Y3 DISTI # ECF840AAACN-C1-Y3 | Micron Technology Inc | LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C1-Y3) RoHS: Compliant Min Qty: 1 Container: Waffle Pack | Americas - 0 | |
| ECF840AAACN-C1-Y3-ES DISTI # ECF840AAACN-C1-Y3-ES | Micron Technology Inc | LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C1-Y3-ES) RoHS: Compliant Min Qty: 1 Container: Waffle Pack | Americas - 0 | |
| ECF840AAACN-C1-Y3 DISTI # 340-293524 | Micron Technology Inc | DRAM LPDDR3 8G Die 256MX32 | 0 |
|
| Imagen | Parte # | Descripción |
|---|---|---|
|
Mfr.#: ECF840AAACN-C1-Y3 OMO.#: OMO-ECF840AAACN-C1-Y3 |
DRAM LPDDR3 8G Die 256MX32 |
|
|
Mfr.#: ECF840AAACN-C1-Y3 |
IC DRAM 8G PARALLEL |
|
|
Mfr.#: ECF840AAACN-C2-Y3 |
IC DRAM 8G PARALLEL |
|
|
Mfr.#: ECF840AAACN-Y3 OMO.#: OMO-ECF840AAACN-Y3-1190 |
LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-Y3) |
