 |  | | |
| PartNumber | ZSSC3026CI1D | ZSSC3026CI1B | ZSSC3026CI1C |
| Description | Sensor Interface ZSSC3026CI4R IN DIE WAFFLE PACK | WAFER (UNSAWN) - BOX | DICE (WAFER SAWN) - FRAME |
| Manufacturer | IDT (Integrated Device Technology) | - | - |
| Product Category | Sensor Interface | - | - |
| RoHS | Y | - | - |
| Mounting Style | SMD/SMT | - | - |
| Package / Case | QFN-24 | - | - |
| Packaging | Waffle | - | - |
| Brand | IDT | - | - |
| Product Type | Sensor Interface | - | - |
| Factory Pack Quantity | 48 | - | - |
| Subcategory | Interface ICs | - | - |
| Unit Weight | 0.032741 oz | - | - |
| Fabricante | Parte # | Descripción | RFQ |
|---|---|---|---|
IDT |
ZSSC3026CI1D | Sensor Interface ZSSC3026CI4R IN DIE WAFFLE PACK | |
| ZSSC3026CI1B | WAFER (UNSAWN) - BOX | ||
| ZSSC3026CI1C | DICE (WAFER SAWN) - FRAME | ||
| ZSSC3026CI1D ES | Nuevo y original |