 | | | |
| PartNumber | LDB211G8010C-001 | LDB211G8005C-001 | LDB211G8020C-001 |
| Description | Signal Conditioning 0805 1.80GHz 100ohm Baluns | Signal Conditioning 0805 1.80GHz 50ohm Baluns | Signal Conditioning 0805 1.80GHz 200ohm Baluns |
| Manufacturer | MURATA | MURATA | MURATA |
| Product Category | IC Chips | IC Chips | IC Chips |
| Series | LDB | LDB | LDB |
| Product | Baluns | Baluns | Baluns |
| Type | Chip Multilayer Hybrid Balun | Chip Multilayer Hybrid Balun | Chip Multilayer Hybrid Balun |
| Packaging | Reel | Reel | Reel |
| Unit Weight | 0.000194 oz | 0.000194 oz | 0.000194 oz |
| Termination Style | SMD/SMT | SMD/SMT | SMD/SMT |
| Qualification | Commercial | Commercial | Commercial |
| Mounting | SMD/SMT | SMD/SMT | SMD/SMT |
| Operating Temperature Range | - 40 C to + 85 C | - 40 C to + 85 C | - 40 C to + 85 C |
| Frequency | 1.8 GHz | 1.8 GHz | 1.8 GHz |
| Impedance | 100 Ohms | 50 Ohms | 200 Ohms |
| Frequency Range | 1700 MHz to 1900 MHz | 1700 MHz to 1900 MHz | 1700 MHz to 1900 MHz |
| Package Case | 0805 (2012 metric) | 0805 (2012 metric) | 0805 (2012 metric) |