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| PartNumber | 814-AG11D | 814-AG10D-ES | 814-AG11D-ES |
| Description | IC & Component Sockets 14 PIN DIP SOCKET | CONN IC DIP SOCKET 14POS GOLD | IC & Component Sockets PC MOUNT 14 PINS |
| Manufacturer | TE Connectivity | - | TE Connectivity AMP Connectors |
| Product Category | IC & Component Sockets | - | Sockets for ICs, Transistors |
| RoHS | N | - | - |
| Product | DIP / SIP Sockets | - | - |
| Pitch | 2.54 mm | - | - |
| Contact Plating | Gold | - | - |
| Brand | TE Connectivity / AMP | - | - |
| Contact Material | Beryllium Copper | - | - |
| Mounting Style | SMD/SMT | - | - |
| Maximum Operating Temperature | + 125 C | - | - |
| Minimum Operating Temperature | 0 C | - | - |
| Product Type | IC & Component Sockets | - | - |
| Factory Pack Quantity | 34 | - | - |
| Subcategory | IC & Component Sockets | - | - |
| Part # Aliases | 2-1437537-4 | - | - |
| Series | - | - | 800 |
| Type | - | - | DIP, 0.3" (7.62mm) Row Spacing |
| Packaging | - | - | Tube |
| Termination | - | - | Solder |
| Operating Temperature | - | - | -55°C ~ 105°C |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Open Frame |
| Housing Material | - | - | Polyester |
| Number of Positions or Pins Grid | - | - | 14 (2 x 7) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Gold |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Tin-Lead |
| Contact Finish Thickness Mating | - | - | 25μin (0.63μm) |
| Contact Material Mating | - | - | Copper Alloy |
| Contact Finish Thickness Post | - | - | 80μin (2.03μm) |
| Contact Material Post | - | - | Copper Alloy |