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| PartNumber | 36-6552-16 | 36-6552-11 | 36-6552-10 |
| Description | IC & Component Sockets DIP TEST SCKT NICKEL 36 PINS | IC & Component Sockets DIP TEST SCKT GOLD 36 PINS | IC & Component Sockets DIP TEST SCKT TIN 36 PINS |
| Manufacturer | Aries Electronics | - | Aries Electronics |
| Product Category | Sockets for ICs, Transistors | - | Sockets for ICs, Transistors |
| Series | 55 | - | 55 |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | - | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Packaging | Bulk | - | Bulk |
| Termination | Solder | - | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | Through Hole | - | Through Hole |
| Features | Closed Frame | - | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | - | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins Grid | 36 (2 x 18) | - | 36 (2 x 18) |
| Pitch Mating | 0.100" (2.54mm) | - | 0.100" (2.54mm) |
| Contact Finish Mating | Nickel Boron | - | Tin |
| Pitch Post | 0.100" (2.54mm) | - | 0.100" (2.54mm) |
| Contact Finish Post | Nickel Boron | - | Tin |
| Contact Finish Thickness Mating | 50μin (1.27μm) | - | 200μin (5.08μm) |
| Contact Material Mating | Beryllium Copper | - | Beryllium Copper |
| Contact Finish Thickness Post | 50μin (1.27μm) | - | 200μin (5.08μm) |
| Contact Material Post | Beryllium Copper | - | Beryllium Copper |