 |  | | |
| PartNumber | 32-6575-10 | 32-6575-16 | 32-6575-11 |
| Description | IC & Component Sockets QUICK RELEASE 32 PIN TIN | IC & Component Sockets QUICK RELEASE 32 PIN NICKEL | IC & Component Sockets QUICK RELEASE 32 PIN GOLD |
| Manufacturer | Aries Electronics | Aries Electronics | - |
| Product Category | IC & Component Sockets | Sockets for ICs, Transistors | - |
| RoHS | Y | - | - |
| Product | Zero Insertion Force (ZIF) Sockets | - | - |
| Number of Positions | 32 Position | - | - |
| Contact Plating | Tin | - | - |
| Series | X57X | 57 | - |
| Brand | Aries Electronics | - | - |
| Mounting Style | PCB | - | - |
| Product Type | IC & Component Sockets | - | - |
| Factory Pack Quantity | 8 | - | - |
| Subcategory | IC & Component Sockets | - | - |
| Type | - | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | - |
| Packaging | - | Bulk | - |
| Termination | - | Solder | - |
| Operating Temperature | - | - | - |
| Mounting Type | - | Through Hole | - |
| Features | - | Closed Frame | - |
| Housing Material | - | Polyphenylene Sulfide (PPS), Glass Filled | - |
| Number of Positions or Pins Grid | - | 32 (2 x 16) | - |
| Pitch Mating | - | 0.100" (2.54mm) | - |
| Contact Finish Mating | - | Tin | - |
| Pitch Post | - | 0.100" (2.54mm) | - |
| Contact Finish Post | - | Tin | - |
| Contact Finish Thickness Mating | - | 200μin (5.08μm) | - |
| Contact Material Mating | - | Beryllium Copper | - |
| Contact Finish Thickness Post | - | 200μin (5.08μm) | - |
| Contact Material Post | - | Beryllium Copper | - |
| Fabricante | Parte # | Descripción | RFQ |
|---|---|---|---|
Aries Electronics |
32-6575-10 | IC & Component Sockets QUICK RELEASE 32 PIN TIN | |
| 32-6575-18 | IC & Component Sockets QUICK RELEASE 32 PIN HI TEMP | ||
| 32-6575-16 | IC & Component Sockets QUICK RELEASE 32 PIN NICKEL | ||
| 32-6575-10 | IC & Component Sockets QUICK RELEASE 32 PIN TIN | ||
| 32-6575-11 | IC & Component Sockets QUICK RELEASE 32 PIN GOLD |