PartNumber | 28-3551-18 | 28-3551-16 | 28-3551-11 |
Description | IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 28 PINS | IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS | IC & Component Sockets DIP TEST SCKT GOLD 28 PINS |
Manufacturer | Aries Electronics | Aries Electronics | - |
Product Category | Sockets for ICs, Transistors | Sockets for ICs, Transistors | - |
Series | 55 | 55 | - |
Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - |
Packaging | Bulk | Bulk | - |
Termination | Solder | Solder | - |
Operating Temperature | -55°C ~ 250°C | - | - |
Mounting Type | Through Hole | Through Hole | - |
Features | Closed Frame | Closed Frame | - |
Housing Material | Polyetheretherketone (PEEK), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | - |
Number of Positions or Pins Grid | 28 (2 x 14) | 28 (2 x 14) | - |
Pitch Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | - |
Contact Finish Mating | Nickel Boron | Nickel Boron | - |
Pitch Post | 0.100" (2.54mm) | 0.100" (2.54mm) | - |
Contact Finish Post | Nickel Boron | Nickel Boron | - |
Contact Finish Thickness Mating | 50μin (1.27μm) | 50μin (1.27μm) | - |
Contact Material Mating | Beryllium Nickel | Beryllium Copper | - |
Contact Finish Thickness Post | 50μin (1.27μm) | 50μin (1.27μm) | - |
Contact Material Post | Beryllium Nickel | Beryllium Copper | - |