 |  | | |
| PartNumber | 14-6501-20 | 14-6501-21 | 14-6501-30 |
| Description | IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS TIN | IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS GOLD | IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS TIN |
| Manufacturer | Aries Electronics | Aries Electronics | - |
| Product Category | IC & Component Sockets | Sockets for ICs, Transistors | - |
| RoHS | T | - | - |
| Number of Positions | 14 Position | - | - |
| Number of Rows | 2 Row | - | - |
| Pitch | 2.54 mm | - | - |
| Termination Style | Wire Wrap | - | - |
| Contact Plating | Tin | - | - |
| Series | 501 | 501 | - |
| Brand | Aries Electronics | - | - |
| Product Type | IC & Component Sockets | - | - |
| Factory Pack Quantity | 25 | - | - |
| Subcategory | IC & Component Sockets | - | - |
| Type | - | DIP, 0.6" (15.24mm) Row Spacing | - |
| Packaging | - | Bulk | - |
| Termination | - | Wire Wrap | - |
| Operating Temperature | - | -55°C ~ 125°C | - |
| Mounting Type | - | Through Hole | - |
| Features | - | Closed Frame | - |
| Housing Material | - | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
| Number of Positions or Pins Grid | - | 14 (2 x 7) | - |
| Pitch Mating | - | 0.100" (2.54mm) | - |
| Contact Finish Mating | - | Gold | - |
| Pitch Post | - | 0.100" (2.54mm) | - |
| Contact Finish Post | - | Gold | - |
| Contact Finish Thickness Mating | - | 10μin (0.25μm) | - |
| Contact Material Mating | - | Phosphor Bronze | - |
| Contact Finish Thickness Post | - | 10μin (0.25μm) | - |
| Contact Material Post | - | Phosphor Bronze | - |
| Fabricante | Parte # | Descripción | RFQ |
|---|---|---|---|
Aries Electronics |
14-6501-20 | IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS TIN | |
| 14-6501-31 | IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS GOLD | ||
| 14-6501-21 | IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS GOLD | ||
| 14-6501-20 | IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS TIN | ||
| 14-6501-30 | IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS TIN |