115-43-308

115-43-308-61-001000 vs 115-43-308-41-003000 vs 115-43-308-41-001000

 
PartNumber115-43-308-61-001000115-43-308-41-003000115-43-308-41-001000
DescriptionIC & Component Sockets DIP Dual In Line SocketIC & Component Sockets 8P Sn PIN/Au CONTACTIC & Component Sockets 8P VERY LOW PROFILE
ManufacturerMill-MaxMill-MaxMill-Max Manufacturing Corp.
Product CategoryIC & Component SocketsIC & Component SocketsSockets for ICs, Transistors
RoHSYY-
Series01150115115
PackagingTubeTubeTube
BrandMill-MaxMill-Max-
Product TypeIC & Component SocketsIC & Component Sockets-
Factory Pack Quantity5050-
SubcategoryIC & Component SocketsIC & Component Sockets-
Product-DIP / SIP Sockets-
Number of Positions-8 Position-
Number of Rows-2 Row-
Type-Open FrameDIP, 0.3" (7.62mm) Row Spacing
Pitch-2.54 mm-
Termination Style-Solder Tail-
Contact Plating-Gold-
Row Spacing-7.62 mm-
Current Rating-3 A-
Features-DIP socket, ultra low profileOpen Frame
Housing Material-Polybutylene Terephthalate (PBT)Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Voltage Rating-1 kV-
Case Style-DIP-
Contact Material-Beryllium Copper-
Flammability Rating-UL 94 V-0-
Mounting Style-Through Hole-
Maximum Operating Temperature-+ 125 C-
Minimum Operating Temperature-- 55 C-
Termination--Solder
Operating Temperature---55°C ~ 125°C
Mounting Type--Through Hole
Number of Positions or Pins Grid--8 (2 x 4)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Tin
Contact Finish Thickness Mating--30μin (0.76μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--200μin (5.08μm)
Contact Material Post--Brass Alloy
Fabricante Parte # Descripción RFQ
Mill-Max
Mill-Max
115-43-308-61-001000 IC & Component Sockets DIP Dual In Line Socket
115-43-308-41-003000 IC & Component Sockets 8P Sn PIN/Au CONTACT
115-43-308-61-003000 IC & Component Sockets DIP Dual In Line Socket
115-43-308-41-001000 IC & Component Sockets 8P VERY LOW PROFILE
115-43-308-41-003000 IC & Component Sockets 8P Sn PIN/Au CONTACT
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