PartNumber | INMP510ACEZ-R7 | INMP510ACEZ | INMP510ACEZ-R0 |
Description | MEMS Microphones RF-Hardened, Low-Noise Microphone with Bottom Port and Analog Output | RF-Hardened Ultralow Noise Analog MEMS Microphone | MIC MEMS ANLG OMNI -38DB |
Manufacturer | TDK | InvenSense | InvenSense |
Product Category | MEMS Microphones | Microphones | Microphones |
RoHS | Y | - | - |
Sensitivity | - 38 dB | -38dB ±2dB @ 94dB SPL | -38dB ±2dB @ 94dB SPL |
Tolerance | 2 dB | - | - |
SNR Signal to Noise Ratio | 65 dB | - | - |
Impedance | - | 350 Ohm | 350 Ohm |
Frequency Range | 60 Hz to 20 kHz | 60Hz ~ 20kHz | 60Hz ~ 20kHz |
Operating Supply Current | 210 uA | - | - |
Operating Supply Voltage | 3.3 V | - | - |
Minimum Operating Temperature | - 40 C | - | - |
Maximum Operating Temperature | + 85 C | - | - |
Output Type | Analog | Analog | Analog |
Port Type | Bottom | - | - |
Length | 3.35 mm | - | - |
Width | 2.5 mm | - | - |
Depth | 0.98 mm | - | - |
Packaging | Reel | Digi-ReelR Alternate Packaging | Digi-ReelR Alternate Packaging |
Directional Properties | Omnidirectional | - | - |
Package / Case | LGA-3 | - | - |
Sound Pressure Level | 160 dB | - | - |
Termination Style | SMD/SMT | - | - |
Type | RF-Hardened, Ultra-Low Noise Microphone | MEMS (Silicon) | MEMS (Silicon) |
Brand | TDK InvenSense | - | - |
Mounting Style | SMD/SMT | - | - |
Shape | Rectangular | Rectangular | Rectangular |
Product Type | MEMS Microphones | - | - |
Factory Pack Quantity | 1000 | - | - |
Subcategory | Microphones | - | - |
Supply Voltage Max | 3.63 V | - | - |
Supply Voltage Min | 1.5 V | - | - |
Series | - | INMP510 | INMP510 |
Termination | - | Solder Pads | Solder Pads |
Voltage Rated | - | 1.5 ~ 3.63V | 1.5 ~ 3.63V |
Current Supply | - | 250μA | 250μA |
Port Location | - | Bottom | Bottom |
Size Dimension | - | 3.35mm L x 2.50mm W | 3.35mm L x 2.50mm W |
Direction | - | Omnidirectional | Omnidirectional |
S N Ratio | - | 65dB | 65dB |
Seal Rating | - | None | None |
Height Max | - | 1.08mm | 1.08mm |