68-PGM11033-10 vs 68-PGM11033-10H vs 68-PGM11033-11

 
PartNumber68-PGM11033-1068-PGM11033-10H68-PGM11033-11
DescriptionIC & Component SocketsIC & Component Sockets PIN GRID ARRAY SOLDER TAIL 68 PINSIC & Component Sockets PIN GRID ARRAY SOLDER TAIL 68 PINS
ManufacturerAries ElectronicsAries ElectronicsAries Electronics
Product CategoryIC & Component SocketsIC & Component SocketsSockets for ICs, Transistors
RoHSYN-
ProductPGA SocketsPGA Sockets-
Number of Positions68 Position--
TypePin Grid Array Socket-PGA
Pitch2.54 mm--
Termination StyleSolder TailSolder Tail-
Contact PlatingGold--
Row Spacing---
Current Rating3 A--
Housing MaterialNylon-Polyamide (PA46), Nylon 4/6, Glass Filled
BrandAries ElectronicsAries Electronics-
Contact MaterialBrass--
Flammability RatingUL 94 V-0--
Lead Length3.18 mm--
Mounting StyleThrough Hole--
Maximum Operating Temperature+ 125 C--
Minimum Operating Temperature- 55 C--
Product TypeIC & Component SocketsIC & Component Sockets-
Factory Pack Quantity11-
SubcategoryIC & Component SocketsIC & Component Sockets-
Series-PGMPGM
Packaging--Bulk
Termination--Solder
Operating Temperature---55°C ~ 125°C
Mounting Type--Through Hole
Features---
Number of Positions or Pins Grid---
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Gold
Contact Finish Thickness Mating--10μin (0.25μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--10μin (0.25μm)
Contact Material Post--Brass
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