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| PartNumber | 40-6554-11 | 40-6554-16 | 40-6554-10 |
| Description | IC & Component Sockets 40 PIN W/HANDLE 1 | IC & Component Sockets 40P ZIF NKL PLTD | IC & Component Sockets 40P TEST SOCKET TIN |
| Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
| Product Category | IC & Component Sockets | IC & Component Sockets | Sockets for ICs, Transistors |
| RoHS | Y | T | - |
| Product | Zero Insertion Force (ZIF) Sockets | - | - |
| Number of Positions | 40 Position | - | - |
| Number of Rows | 2 Row | 2 Row | - |
| Type | Closed Frame | - | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Pitch | 2.54 mm | 2.54 mm | - |
| Termination Style | Solder Tail | Solder Pin | - |
| Contact Plating | Gold | Nickel Boron | - |
| Row Spacing | 15.24 mm | - | - |
| Series | X55X | X55X | 55 |
| Current Rating | 1 A | - | - |
| Features | Universal ZIF DIP | - | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS) | - | Polyphenylene Sulfide (PPS), Glass Filled |
| Voltage Rating | 1 kVAC | - | - |
| Brand | Aries Electronics | Aries Electronics | - |
| Case Style | DIP | - | - |
| Contact Material | Beryllium Copper | - | - |
| Flammability Rating | UL 94 V-0 | - | - |
| Mounting Style | Through Hole | Through Hole | - |
| Maximum Operating Temperature | + 150 C | - | - |
| Minimum Operating Temperature | - 55 C | - | - |
| Product Type | IC & Component Sockets | IC & Component Sockets | - |
| Factory Pack Quantity | 7 | 7 | - |
| Subcategory | IC & Component Sockets | IC & Component Sockets | - |
| Unit Weight | 1.279986 oz | - | - |
| Packaging | - | - | Bulk |
| Termination | - | - | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | - | - | Through Hole |
| Number of Positions or Pins Grid | - | - | 40 (2 x 20) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Tin |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Tin |
| Contact Finish Thickness Mating | - | - | 200μin (5.08μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | 200μin (5.08μm) |
| Contact Material Post | - | - | Beryllium Copper |