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| PartNumber | 28-6570-16 | 28-6570-11 | 28-6570-10 |
| Description | IC & Component Sockets QUICK RELEASE 28 PIN NICKEL | IC & Component Sockets QUICK RELEASE 28 PIN GOLD | IC & Component Sockets QUICK RELEASE 28 PIN TIN |
| Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
| Product Category | Sockets for ICs, Transistors | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
| Series | 57 | 57 | 57 |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Packaging | Bulk | Bulk | Bulk |
| Termination | Solder | Solder | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | Through Hole | Through Hole | Through Hole |
| Features | Closed Frame | Closed Frame | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins Grid | 28 (2 x 14) | 28 (2 x 14) | 28 (2 x 14) |
| Pitch Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Mating | Nickel Boron | Gold | Tin |
| Pitch Post | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Post | Nickel Boron | Gold | Tin |
| Contact Finish Thickness Mating | 50μin (1.27μm) | 10μin (0.25μm) | 200μin (5.08μm) |
| Contact Material Mating | Beryllium Nickel | Beryllium Copper | Beryllium Copper |
| Contact Finish Thickness Post | 50μin (1.27μm) | 10μin (0.25μm) | 200μin (5.08μm) |
| Contact Material Post | Beryllium Nickel | Beryllium Copper | Beryllium Copper |