24-3573-10 vs 24-3573-16 vs 24-3573-11

 
PartNumber24-3573-1024-3573-1624-3573-11
DescriptionIC & Component Sockets QUICK RELEASE 24 PIN TINIC & Component Sockets QUICK RELEASE 24 PIN NICKELIC & Component Sockets QUICK RELEASE 24 PIN GOLD
ManufacturerAries ElectronicsAries ElectronicsAries Electronics
Product CategoryIC & Component SocketsSockets for ICs, TransistorsSockets for ICs, Transistors
RoHSY--
ProductZero Insertion Force (ZIF) Sockets--
Number of Positions24 Position--
Contact PlatingTin--
SeriesX57X5757
BrandAries Electronics--
Mounting StylePCB--
Product TypeIC & Component Sockets--
Factory Pack Quantity12--
SubcategoryIC & Component Sockets--
Type-DIP, ZIF (ZIP), 0.3" (7.62mm) Row SpacingDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Packaging-BulkBulk
Termination-SolderSolder
Operating Temperature---
Mounting Type-Through HoleThrough Hole
Features-Closed FrameClosed Frame
Housing Material-Polyphenylene Sulfide (PPS), Glass FilledPolyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins Grid-24 (2 x 12)24 (2 x 12)
Pitch Mating-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Mating-Nickel BoronGold
Pitch Post-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Post-Nickel BoronGold
Contact Finish Thickness Mating-50μin (1.27μm)10μin (0.25μm)
Contact Material Mating-Beryllium NickelBeryllium Copper
Contact Finish Thickness Post-50μin (1.27μm)10μin (0.25μm)
Contact Material Post-Beryllium NickelBeryllium Copper
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