PartNumber | 225-PGM15001-51 | 225-PGM15001-10 | 225-PLS15001-16 |
Description | IC & Component Sockets PIN GRID ARRAY SOLDER TAIL 225 PINS | IC & Component Sockets | IC & Component Sockets 225P PGA TEST SOCKET |
Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
Product Category | IC & Component Sockets | IC & Component Sockets | Sockets for ICs, Transistors |
RoHS | N | - | - |
Product | PGA Sockets | PGA Sockets | - |
Termination Style | Solder Tail | Solder Tail | - |
Series | PGM | - | PLS |
Brand | Aries Electronics | Aries Electronics | - |
Product Type | IC & Component Sockets | IC & Component Sockets | - |
Factory Pack Quantity | 1 | 1 | - |
Subcategory | IC & Component Sockets | IC & Component Sockets | - |
Number of Positions | - | 225 Position | - |
Type | - | Pin Grid Array Socket | PGA, ZIF (ZIP) |
Pitch | - | 2.54 mm | - |
Contact Plating | - | Gold | - |
Row Spacing | - | - | - |
Current Rating | - | 3 A | - |
Housing Material | - | Nylon | Polyphenylene Sulfide (PPS) |
Contact Material | - | Brass | - |
Flammability Rating | - | UL 94 V-0 | - |
Lead Length | - | 3.18 mm | - |
Mounting Style | - | Through Hole | - |
Maximum Operating Temperature | - | + 125 C | - |
Minimum Operating Temperature | - | - 55 C | - |
Packaging | - | - | Bulk |
Termination | - | - | Solder |
Operating Temperature | - | - | -65°C ~ 200°C |
Mounting Type | - | - | Through Hole |
Features | - | - | Closed Frame |
Number of Positions or Pins Grid | - | - | - |
Pitch Mating | - | - | 0.100" (2.54mm) |
Contact Finish Mating | - | - | Gold |
Pitch Post | - | - | 0.100" (2.54mm) |
Contact Finish Post | - | - | Nickel Bronze |
Contact Finish Thickness Mating | - | - | 30μin (0.76μm) |
Contact Material Mating | - | - | Beryllium Copper |
Contact Finish Thickness Post | - | - | 50μin (1.27μm) |
Contact Material Post | - | - | Beryllium Copper |