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216-3340-19-0602J vs 216-3340-09-0602J vs 216-3340-00-0602J

 
PartNumber216-3340-19-0602J216-3340-09-0602J216-3340-00-0602J
DescriptionIC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty.IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty.IC & Component Sockets 0.100" DIP SOCKET 16 Contact Qty.
Manufacturer3M3M3M
Product CategoryIC & Component SocketsSockets for ICs, Transistors - AdaptersSockets for ICs, Transistors
RoHSY--
ProductZero Insertion Force (ZIF) Sockets--
Number of Positions16 Position--
Pitch2.54 mm--
Termination StyleThrough Hole--
Contact PlatingGold--
Current Rating1 A--
Housing MaterialPolysulfonePolysulfone (PSU), Glass FilledPolysulfone (PSU), Glass Filled
Brand3M Electronic Solutions Division--
Contact MaterialBeryllium Copper--
Flammability RatingUL 94 V-0--
Mounting Style---
Maximum Operating Temperature+ 150 C--
Minimum Operating Temperature- 55 C--
Product TypeIC & Component Sockets--
Factory Pack Quantity10--
SubcategoryIC & Component Sockets--
Part # Aliases05113869612 JE150900296--
Unit Weight0.533242 oz--
Series-TextoolTextool
Termination-SolderPress-Fit
Mounting Type-Through HoleConnector
Number of Pins-16-
Convert From Adapter End-DIP, 0.3" (7.62mm) Row Spacing-
Convert To Adapter End-DIP, 0.3" (7.62mm) Row Spacing-
Pitch Mating-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Mating-GoldGold
Pitch Post-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Post-GoldGold
Board Material---
Type--DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Packaging--Bulk
Operating Temperature---55°C ~ 125°C
Features--Closed Frame
Number of Positions or Pins Grid--16 (2 x 8)
Contact Finish Thickness Mating--30μin (0.76μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--30μin (0.76μm)
Contact Material Post--Beryllium Copper
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