18-3518-101H vs 18-3518-101 vs 18-3518-10

 
PartNumber18-3518-101H18-3518-10118-3518-10
DescriptionIC & Component SocketsIC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 18 PINSIC & Component Sockets 18P SOLDER TIN/GLD
ManufacturerAries Electronics-Aries Electronics
Product CategoryIC & Component Sockets-Sockets for ICs, Transistors
ProductDIP / SIP Sockets--
Number of Positions18 Position--
Number of Rows2 Row--
TypeOpen Frame Capacitor Collet Socket-DIP, 0.3" (7.62mm) Row Spacing
Pitch2.54 mm--
Termination StyleSolder Tail--
Contact PlatingGold Collet / Tin Shell--
Row Spacing7.62 mm--
Current Rating3 A--
Housing MaterialPolyester Thermoplastic (PBT)-Polyamide (PA46), Nylon 4/6, Glass Filled
BrandAries Electronics--
Case StyleOpen Frame--
Contact MaterialBeryllium Copper--
Flammability RatingUL 94 V-0--
Lead Length3.18 mm--
Mounting StyleThrough Hole--
Maximum Operating Temperature+ 125 C--
Product TypeIC & Component Sockets--
Factory Pack Quantity1--
SubcategoryIC & Component Sockets--
Series--518
Packaging--Bulk
Termination--Solder
Operating Temperature---
Mounting Type--Through Hole
Features--Open Frame
Number of Positions or Pins Grid--18 (2 x 9)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Tin
Contact Finish Thickness Mating--10μin (0.25μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--200μin (5.08μm)
Contact Material Post--Brass
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