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| PartNumber | 1109681-318 | 1109681-316 | 1109681-314 |
| Description | IC & Component Sockets MIRROR IMAGE COLLET 18 PINS | IC & Component Sockets MIRROR IMAGE COLLET 16 PINS | IC & Component Sockets MIRROR IMAGE COLLET 14 PINS |
| Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
| Product Category | Sockets for ICs, Transistors | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
| Series | - | - | - |
| Type | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing |
| Packaging | Bulk | Bulk | Bulk |
| Termination | Solder | Solder | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | Through Hole | Through Hole | Through Hole |
| Features | Spacer | Spacer | Spacer |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Number of Positions or Pins Grid | 28 (2 x 14) | 16 (2 x 8) | 14 (2 x 7) |
| Pitch Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Mating | Gold | Gold | Gold |
| Pitch Post | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Post | Tin-Lead | Tin-Lead | Tin-Lead |
| Contact Finish Thickness Mating | 10μin (0.25μm) | 10μin (0.25μm) | 10μin (0.25μm) |
| Contact Material Mating | Brass | Brass | Brass |
| Contact Finish Thickness Post | 200μin (5.08μm) | 200μin (5.08μm) | 200μin (5.08μm) |
| Contact Material Post | Brass | Brass | Brass |