110-93-318-41-105000 vs 110-93-318-41-001000 vs 110-93-318-41-001

 
PartNumber110-93-318-41-105000110-93-318-41-001000110-93-318-41-001
DescriptionIC & Component Sockets STANDRD SOLDER TAIL DIP SOCKETIC & Component Sockets 18P TIN PIN GLD CONTConnector, Dip Socket, 18 Pin, 300 Mil, PC Mount (Also Known As: 110-93-318-41-001)
ManufacturerMill-MaxMill-MaxMill-Max Manufacturing Corp.
Product CategoryIC & Component SocketsIC & Component SocketsSockets for ICs, Transistors
ProductDIP / SIP SocketsDIP / SIP Sockets-
Pitch2.54 mm2.54 mm-
Contact PlatingGoldGold-
Series01100110110
PackagingTubeTubeTube
BrandMill-MaxMill-Max-
Mounting StyleSMD/SMTThrough Hole-
Product TypeIC & Component SocketsIC & Component Sockets-
Factory Pack Quantity2222-
SubcategoryIC & Component SocketsIC & Component Sockets-
RoHS-N-
Number of Positions-18 Position-
Number of Rows-2 Row-
Type-Open FrameDIP, 0.3" (7.62mm) Row Spacing
Termination Style-Solder Tail-
Row Spacing-7.62 mm-
Current Rating-3 A-
Features-DIP socketOpen Frame
Housing Material-Polybutylene Terephthalate (PBT)Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Voltage Rating-1 kV-
Case Style-DIP-
Contact Material-Beryllium Copper-
Flammability Rating-UL 94 V-0-
Maximum Operating Temperature-+ 125 C-
Minimum Operating Temperature-- 55 C-
Unit Weight-0.240004 oz-
Termination--Solder
Operating Temperature---55°C ~ 125°C
Mounting Type--Through Hole
Number of Positions or Pins Grid--18 (2 x 9)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Tin-Lead
Contact Finish Thickness Mating--30μin (0.76μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--200μin (5.08μm)
Contact Material Post--Brass Alloy
Top