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| PartNumber | 10-3503-30 | 10-3503-20 | 10-3503-21 |
| Description | IC & Component Sockets 10P COLLET SOCKET .300" WIRE WRAP | IC & Component Sockets 10P .300 WIRE WRAP | CONN IC DIP SOCKET 10POS GOLD |
| Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
| Product Category | IC & Component Sockets | IC & Component Sockets | Sockets for ICs, Transistors |
| RoHS | Y | Y | - |
| Series | 513 | 513 | 503 |
| Brand | Aries Electronics | Aries Electronics | - |
| Product Type | IC & Component Sockets | IC & Component Sockets | - |
| Factory Pack Quantity | 1 | 1 | - |
| Subcategory | IC & Component Sockets | IC & Component Sockets | - |
| Product | - | DIP / SIP Sockets | - |
| Number of Positions | - | 10 Position | - |
| Termination Style | - | Solder Pin | - |
| Contact Plating | - | Gold | - |
| Mounting Style | - | PCB | - |
| Maximum Operating Temperature | - | + 125 C | - |
| Minimum Operating Temperature | - | - 55 C | - |
| Type | - | - | DIP, 0.3" (7.62mm) Row Spacing |
| Packaging | - | - | Bulk |
| Termination | - | - | Wire Wrap |
| Operating Temperature | - | - | -55°C ~ 125°C |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Closed Frame |
| Housing Material | - | - | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Number of Positions or Pins Grid | - | - | 10 (2 x 5) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Gold |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Gold |
| Contact Finish Thickness Mating | - | - | 10μin (0.25μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | 10μin (0.25μm) |
| Contact Material Post | - | - | Phosphor Bronze |