ZOPT1200AC4C

ZOPT1200AC4C
Mfr. #:
ZOPT1200AC4C
Fabricante:
IDT, Integrated Device Technology Inc
Descripción:
DICE (WAFER SAWN) - FRAME
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
ZOPT1200AC4C Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Atributo del producto
Valor de atributo
Tags
ZOPT1200, ZOPT1, ZOPT, ZOP
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et Europe
Dice (Wafer sawn) - frame
Parte # Mfg. Descripción Valores Precio
ZOPT1200AC4C
DISTI # ZOPT1200AC4C-ND
Integrated Device Technology IncDICE (WAFER SAWN) - FRAME
RoHS: Not compliant
Container: Tray
Temporarily Out of Stock
    ZOPT1200AC4CT
    DISTI # ZOPT1200AC4CT-ND
    Integrated Device Technology IncDICE (WAFER SAWN) - FRAME
    RoHS: Not compliant
    Container: Tray
    Temporarily Out of Stock
      ZOPT1200AC4C
      DISTI # ZOPT1200AC4C
      Integrated Device Technology IncDice (Wafer sawn) - frame - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZOPT1200AC4C)
      RoHS: Compliant
      Min Qty: 18371
      Container: Waffle Pack
      Americas - 0
        ZOPT1200AC4CT
        DISTI # ZOPT1200AC4CT
        Integrated Device Technology IncDice (Wafer sawn) - frame - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZOPT1200AC4CT)
        RoHS: Compliant
        Min Qty: 20412
        Container: Waffle Pack
        Americas - 0
          Imagen Parte # Descripción
          ZOPT1200AC1B

          Mfr.#: ZOPT1200AC1B

          OMO.#: OMO-ZOPT1200AC1B-1190

          WAFER (UNSAWN) - WAFER BOX
          ZOPT1200AC1BU

          Mfr.#: ZOPT1200AC1BU

          OMO.#: OMO-ZOPT1200AC1BU-1190

          WAFER (UNSAWN) - WAFER BOX
          ZOPT1200AC2B

          Mfr.#: ZOPT1200AC2B

          OMO.#: OMO-ZOPT1200AC2B-1190

          WAFER (UNSAWN) - WAFER BOX
          ZOPT1200AC4C

          Mfr.#: ZOPT1200AC4C

          OMO.#: OMO-ZOPT1200AC4C-1190

          DICE (WAFER SAWN) - FRAME
          ZOPT1200AC4CT

          Mfr.#: ZOPT1200AC4CT

          OMO.#: OMO-ZOPT1200AC4CT-1190

          DICE (WAFER SAWN) - FRAME
          ZOPT1202AC2B

          Mfr.#: ZOPT1202AC2B

          OMO.#: OMO-ZOPT1202AC2B-INTEGRATED-DEVICE-TECH

          AMBIENT LIGHT & UVB SENSOR
          ZOPT1202AC5V ES

          Mfr.#: ZOPT1202AC5V ES

          OMO.#: OMO-ZOPT1202AC5V-ES-INTEGRATED-DEVICE-TECH

          AMBIENT LIGHT & UVB SENSOR
          Disponibilidad
          Valores:
          Available
          En orden:
          3000
          Ingrese la cantidad:
          El precio actual de ZOPT1200AC4C es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
          Precio de referencia (USD)
          Cantidad
          Precio unitario
          Ext. Precio
          1
          0,00 US$
          0,00 US$
          10
          0,00 US$
          0,00 US$
          100
          0,00 US$
          0,00 US$
          500
          0,00 US$
          0,00 US$
          1000
          0,00 US$
          0,00 US$
          Empezar con
          Nuevos productos
          • MAX77714 Power Management IC
            Maxim’s MAX77714 is a power-management IC (PMIC) device for use with system-on-chip (SoC) application processors.
          • NFC-BLE Wireless with TapNLink™
            IoTize's TapNLink TnLFIR103 will enhance user’s experiences with NFC and Bluetooth Low Energy (BLE) wireless connectivity.
          • C3M™ Planar MOSFET Technology
            Wolfspeed’s advanced SiC MOSFET technology is offered in low-inductance discrete packing, allowing engineers to take advantage of C3M™ planar MOSFET chips.
          • MAX22513 Surge-Protected Dual Driver IO-Link Devic
            Maxim's MAX22513 dual-channel low power IO-Link device transceiver boasts selectable control interface, internal regulators, and integrated surge protection.
          • USB 3.0 Cables and Connectors
            Assmann WSW Components' USB 3.0 cables and connectors will multiply the bandwidth tenfold over the USB 2.0 and meets all standards of USB-IF.
          Top