GS816132DD-200

GS816132DD-200
Mfr. #:
GS816132DD-200
Fabricante:
GSI Technology
Descripción:
SRAM 2.5 or 3.3V 512K x 32 16M
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
GS816132DD-200 Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Más información:
GS816132DD-200 más información
Atributo del producto
Valor de atributo
Fabricante:
Tecnología GSI
Categoria de producto:
SRAM
RoHS:
N
Tamaño de la memoria:
18 Mbit
Organización:
512 k x 32
Tiempo de acceso:
6.5 ns
Frecuencia máxima de reloj:
200 MHz
Tipo de interfaz:
Parallel
Voltaje de suministro - Máx:
3.6 V
Voltaje de suministro - Min:
2.3 V
Corriente de suministro - Máx .:
210 mA, 210 mA
Temperatura mínima de funcionamiento:
0 C
Temperatura máxima de funcionamiento:
+ 70 C
Estilo de montaje:
SMD / SMT
Paquete / Caja:
BGA-165
Embalaje:
Bandeja
Tipo de memoria:
SDR
Serie:
GS816132DD
Escribe:
Tubería / Flujo a través
Marca:
Tecnología GSI
Sensible a la humedad:
Yes
Tipo de producto:
SRAM
Cantidad de paquete de fábrica:
36
Subcategoría:
Memoria y almacenamiento de datos
Nombre comercial:
SyncBurst
Tags
GS816132DD-20, GS816132DD-2, GS816132DD, GS816132, GS81613, GS8161, GS816, GS81, GS8
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 32 6.5ns/3ns 165-Pin FBGA
***et
SRAM Chip Sync Dual 1.8V 18M-Bit 2M x 9-Bit 0.45ns 165-Pin FBGA Tray
***-Wing Technology
e0 Surface Mount CY7C1911 Tray ic memory 250MHz 450ps 15mm 430mA
***i-Key
IC SRAM 18MBIT PARALLEL 165FBGA
***or
QDR SRAM, 2MX9, 0.45NS, CMOS, PB
***et
SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray
***-Wing Technology
e0 Surface Mount CY7C1321 Tray ic memory 250MHz 450ps 370mA 18Mb
***ress Semiconductor SCT
DDR-II CIO, 18 Mbit Density, BGA-165
*** Services
CoC and 2-years warranty / RFQ for pricing
***i-Key
IC SRAM 18MBIT PARALLEL 165FBGA
***or
DDR SRAM, 512KX36, 0.45NS, CMOS,
***et
SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray
***-Wing Technology
e1 Surface Mount CY7C1321 Tray ic memory 250MHz 450ps 370mA 18Mb
***ress Semiconductor SCT
DDR-II CIO, 18 Mbit Density, BGA-165, RoHS
***DA Technology Co., Ltd.
Product Description Demo for Development.
***i-Key
IC SRAM 18MBIT PARALLEL 165FBGA
SyncBurst SRAMs
GSI Technology SyncBurst SRAMs are a broad portfolio of Synchronous Burst (SyncBurst™) SRAMs with fast clock rates and low power. SyncBurst SRAMs provide a "burst" of (typically) 2 to 4 words in response to a single clock signal. The devices' simplified interface is designed to use a data bus's maximum bandwidth. SyncBurst SRAMs are used in military, networking, industrial, automotive and medical imaging applications where a mid-range performance point is required.Learn More
Imagen Parte # Descripción
GS816136DGD-200

Mfr.#: GS816136DGD-200

OMO.#: OMO-GS816136DGD-200

SRAM 2.5 or 3.3V 512K x 36 18M
GS816136DD-250I

Mfr.#: GS816136DD-250I

OMO.#: OMO-GS816136DD-250I

SRAM 2.5 or 3.3V 512K x 36 18M
GS816136DGD-250IV

Mfr.#: GS816136DGD-250IV

OMO.#: OMO-GS816136DGD-250IV

SRAM 1.8/2.5V 512K x 36 18M
GS816132DGT-200

Mfr.#: GS816132DGT-200

OMO.#: OMO-GS816132DGT-200

SRAM 2.5 or 3.3V 512K x 32 16M
GS816132DD-150

Mfr.#: GS816132DD-150

OMO.#: OMO-GS816132DD-150

SRAM 2.5 or 3.3V 512K x 32 16M
GS816136DD-250

Mfr.#: GS816136DD-250

OMO.#: OMO-GS816136DD-250

SRAM 2.5 or 3.3V 512K x 36 18M
GS816136DD-150V

Mfr.#: GS816136DD-150V

OMO.#: OMO-GS816136DD-150V

SRAM 1.8/2.5V 512K x 36 18M
GS816132DGD-375I

Mfr.#: GS816132DGD-375I

OMO.#: OMO-GS816132DGD-375I

SRAM 2.5 or 3.3V 512K x 32 16M
GS816136DGD-400I

Mfr.#: GS816136DGD-400I

OMO.#: OMO-GS816136DGD-400I

SRAM 2.5 or 3.3V 512K x 36 18M
GS816132DD-375

Mfr.#: GS816132DD-375

OMO.#: OMO-GS816132DD-375

SRAM 2.5 or 3.3V 512K x 32 16M
Disponibilidad
Valores:
Available
En orden:
5500
Ingrese la cantidad:
El precio actual de GS816132DD-200 es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
Precio de referencia (USD)
Cantidad
Precio unitario
Ext. Precio
1
14,23 US$
14,23 US$
25
13,21 US$
330,25 US$
Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
Empezar con
Nuevos productos
  • High Density (HD) Card Edge Connector
    TE Connectivity AMP's HD card edge connector is one of the highest current density power connectors in the market to support high power supply applications.
  • Compare GS816132DD-200
    GS816132DD200 vs GS816132DD200I vs GS816132DD200IV
  • Dynamic Series Connectors
    TE Connectivity AMP dynamic connectors are designed for exclusive use with I/O and power circuits in power and control boards.
  • 0.8 mm Free Height Connectors
    TE Connectivity AMP next-gen 0.8 mm free height connectors achieve 32 Gbps+ speeds to enable mainstream adoption in high-speed data communication applications.
  • .5 mm Free Height Connectors
    TE Connectivity AMP's .5 mm free height connectors are two-piece, open pin field connectors designed for use in parallel stacking board-to-board applications.
  • RHW Series Tubing
    TE Connectivity's RHW series tubing is heavy wall designed for insulating, protecting, and sealing electrical connections.
Top