| Mfr. #: | XC7Z035-1FBG676C |
|---|---|
| Fabricante: | Xilinx |
| Descripción: | IC SOC CORTEX-A9 KINTEX7 676BGA |
| Ciclo vital: | Nuevo de este fabricante. |
| Ficha de datos: | XC7Z035-1FBG676C Ficha de datos |
Product belongs to the ZynqR-7000 series. Tray is the packaging method for this product 676-BBGA, FCBGA Operational temperature range: 0°C ~ 85°C (TJ) Supplier device package: 676-FCBGA (27x27) Operating frequency: 667MHz The architecture of this product is MCU, FPGA . 256KB of MCU-RAM CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interface Primary-Attributes: Kintex-7 FPGA, 275K Logic Cells
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XC7Z035-1FBG676C Specifications
A: At what frequency does the Series?
Q: The product Series is ZynqR-7000.
A: At what frequency does the Packaging?
Q: The product Packaging is Tray.
A: At what frequency does the Package-Case?
Q: The product Package-Case is 676-BBGA, FCBGA.
A: What is the Operating-Temperature of the product?
Q: The Operating-Temperature of the product is 0°C ~ 85°C (TJ).
A: Is the cutoff frequency of the product Supplier-Device-Package?
Q: Yes, the product's Supplier-Device-Package is indeed 676-FCBGA (27x27)
A: At what frequency does the Speed?
Q: The product Speed is 667MHz.
A: At what frequency does the Architecture?
Q: The product Architecture is MCU, FPGA.
A: What is the MCU-RAM of the product?
Q: The MCU-RAM of the product is 256KB.
A: At what frequency does the Connectivity?
Q: The product Connectivity is CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG.
A: What is the Primary-Attributes of the product?
Q: The Primary-Attributes of the product is Kintex-7 FPGA, 275K Logic Cells.