2144425

2144425
Mfr. #:
2144425
Fabricante:
Cypress Semiconductor
Descripción:
IC FLASH MEMORY
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
2144425 Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Más información:
2144425 más información 2144425 Product Details
Atributo del producto
Valor de atributo
Tags
21444, 2144, 214
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
Parte # Mfg. Descripción Valores Precio
2144425
DISTI # 2144425-ND
Cypress SemiconductorIC FLASH MEMORY
RoHS: Compliant
Min Qty: 1600
Container: Bulk
Limited Supply - Call
    1858109Phoenix ContactPluggable Terminal Blocks 9 Pos 3.81mm Invert Plug 28-16AWG Screw
    RoHS: Compliant
    Americas -
    • 50:$10.8400
    • 100:$10.1300
    • 250:$9.6200
    • 500:$9.1400
    Imagen Parte # Descripción
    2142

    Mfr.#: 2142

    OMO.#: OMO-2142

    Fiber Optic Connectors CHEST BOX (2142)
    2142970-5

    Mfr.#: 2142970-5

    OMO.#: OMO-2142970-5

    Ethernet Cables / Networking Cables MICRO SFP+-STD SFP+ 4M, 26AWG
    214912

    Mfr.#: 214912

    OMO.#: OMO-214912-418

    Board to Board & Mezzanine Connectors 5P 4MM HP FML VERT SMT/THR B-B MEZZ
    214-99-628-01-670799

    Mfr.#: 214-99-628-01-670799

    OMO.#: OMO-214-99-628-01-670799-408

    IC & Component Sockets 28P DIP SMD T/R
    214-120(TO-18/TO-5TRANSI

    Mfr.#: 214-120(TO-18/TO-5TRANSI

    OMO.#: OMO-214-120-TO-18-TO-5TRANSI-1190

    Nuevo y original
    2141608-6

    Mfr.#: 2141608-6

    OMO.#: OMO-2141608-6-1190

    Nuevo y original
    2143SV11FA

    Mfr.#: 2143SV11FA

    OMO.#: OMO-2143SV11FA-1190

    Nuevo y original
    214820

    Mfr.#: 214820

    OMO.#: OMO-214820-1190

    Nuevo y original
    2149905-6

    Mfr.#: 2149905-6

    OMO.#: OMO-2149905-6-1190

    Nuevo y original
    214A532-25-0

    Mfr.#: 214A532-25-0

    OMO.#: OMO-214A532-25-0-TE-CONNECTIVITY

    214A532-25-0
    Disponibilidad
    Valores:
    Available
    En orden:
    3500
    Ingrese la cantidad:
    El precio actual de 2144425 es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
    Precio de referencia (USD)
    Cantidad
    Precio unitario
    Ext. Precio
    1
    0,00 US$
    0,00 US$
    10
    0,00 US$
    0,00 US$
    100
    0,00 US$
    0,00 US$
    500
    0,00 US$
    0,00 US$
    1000
    0,00 US$
    0,00 US$
    Empezar con
    Nuevos productos
    • PSoC® 4 BLE 256 KB Module with Bluetooth®
      Cypress' PSoC 4 BLE 256 KB device, two crystals for the antenna matching network, a PCB antenna and other passives, while providing access to all GPIOs of the device.
    • T543 Series COTS Polymer Electrolytic
      KEMET Organic Capacitor (KO-CAP) is a solid electrolytic capacitor with a conductive polymer cathode capable of delivering low ESR and capacitance retention at high frequencies.
    • HK Series Inductors
      TAIYO YUDEN's HK series inductors have expanded to include price competitive, AEC-Q200 qualified high-reliability version inductors.
    • Piezoelectric Acoustic Modules
      KEMET's multilayer piezoelectric bimorph actuators are ceramic elements used to convert electrical energy into mechanical energy such as displacement or force.
    • CY8CKIT-042-BLE Bluetooth® Low Energy Develop
      The Cypress CY8CKIT-042-BLE development kit supports system-level designs including example projects to enable Bluetooth Low Energy mixed-signal embedded designs.
    Top