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FTMH-159-03-L-DV

FTMH-159-03-L-DV
Mfr. #:
FTMH-159-03-L-DV
Fabricante:
Samtec
Descripción:
CONN HEADER SMD 118POS 1MM
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
FTMH-159-03-L-DV Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
FTMH-159-03-L-DV DatasheetFTMH-159-03-L-DV Datasheet (P4-P5)
ECAD Model:
Atributo del producto
Valor de atributo
Tags
FTMH-15, FTMH-1, FTMH, FTM
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***i-Key
CONN HEADER SMD 118POS 1MM
***er Electronics
Board to Board & Mezzanine Connectors 1.00 mm One-Piece Interface
***ark
Stacking Connector, 100 Position, 1Mm; Mezzanine Connector Type:receptacle; Pitch Spacing:1Mm; No. Of Rows:2Rows; No. Of Contacts:100Contacts; Connector Mounting:surface Mount; Contact Material:beryllium Copper; Gender:receptacle Rohs Compliant: Yes
***ment14 APAC
CONNECTOR, PCB, 1PC, 1MM, 100WAY; Series:FSI; Pitch Spacing:1mm; No. of Rows:2; No. of Contacts:100; Gender:Receptacle; Contact Termination:Solder; Contact Plating:Gold; Contact Material:Beryllium Copper; SVHC:No SVHC (20-Jun-2011); Colour:Black; Connector Type:Interface; Connector Type:Interface; Contact Material:Beryllium Copper; Contact Plating:Gold; Current Rating:1A; Insulator Material:LCP; Lead Spacing:1mm; No. of Ways:100; Operating Temperature Max:125°C; Operating Temperature Min:-55°C; Termination Method:Solder
***er Electronics
Headers & Wire Housings Low Profile Dual-Wipe Socket, 1.00mm Pitch
***et
Conn Socket Strip SKT 88 POS 1mm Solder ST SMD Tube
***i-Key
CONN RCPT 88POS 0.039 GOLD SMD
***ark
Socket, 1.0Mm, Smd, 2X44 Position; Connector Systems:board-To-Board; Pitch Spacing:1Mm; No. Of Rows:2Rows; No. Of Contacts:88Contacts; Connector Mounting:surface Mount; Product Range:clm Series; Contact Material:phosphor Bronze Rohs Compliant: Yes
***er Electronics
Headers & Wire Housings Low Profile Dual-Wipe Socket, 1.00mm Pitch
***et
Conn Socket Strip SKT 84 POS 1mm Solder ST SMD Tube
***i-Key
CONN RCPT 84POS 0.039 GOLD SMD
***ark
Socket, 1.0Mm, Smd, 2X42 Position; Connector Systems:board-To-Board; Pitch Spacing:1Mm; No. Of Rows:2Rows; No. Of Contacts:84Contacts; Connector Mounting:surface Mount; Product Range:clm Series; Contact Material:phosphor Bronze Rohs Compliant: Yes
***ical
Conn PCI Express Card Edge SKT 98 POS 1mm Solder ST Edge Mount Box/Tray
***(Formerly Allied Electronics)
PCI EXP STRADDLE 98P BLK 30uInch, PCI and PCI Express Connectors
***i-Key
CONN PCI EXP FMALE 98POS 0.039
***nell
CONN, CARDEDGE, DUAL SIDE, 98 POS, TH; Card Edge Connector Type: Dual Side; Card Thickness: 1.57mm; No. of Contacts: 98 Contacts; Connector Mounting: Through Hole Mount; Connector Body Orientation: Straight; Contact Terminati
***ell Electronics
.4mm, .5mm, .6mm, .8mm, 1mm, Fine Pitch, Surface Mount, Stacking Bd-to-Bd Connectors
***nell
RECEPTACLE, 11.12MM HEIGHT, 84WAY; Connector Type:Board to Board; Gender:Receptacle; Ways, No. of:84; Lead Spacing:1mm; Termination Method:Solder; Contact Material:Copper Alloy; Series:FH; Contact Plating:Gold; No. of Rows:2; Pitch:1mm
***ark
IEEE 1386 Mezzanine Connector; Connector Type:Stacking; Gender:Receptacle; No. of Contacts:84; Pitch Spacing:1mm; Contact Termination:Surface Mount Vertical; Contact Material:Phosphor Bronze; Series:FH; Contact Plating:Gold ;RoHS Compliant: Yes
***Store
1FHR,84,30A/S,S,N,S11,12 PCB Connector Assembly Type: PCB Mount Receptacle PCB Mount Orientation: Vertical Connector System: Board-to-Board Number of Positions: 84 Centerline (Pitch): .039 in PCB Mount Receptacle Vertical Board-to-Board 84 | Free Height Receptacle Conn: Board-Board & Vertical & 84 & 1Mm | Part Number: 5120603-2 | Internal Number: 5120603-2 | .039"
***inecomponents.com
.4mm, .5mm, .6mm, .8mm, 1mm, Fine Pitch, Surface Mount, Stacking Bd-to-Bd Connectors
***ment14 APAC
STACKING CONNECTOR, PLUG, 84POS, 1MM; Se; STACKING CONNECTOR, PLUG, 84POS, 1MM; Series:FH; Pitch Spacing:1mm; No. of Contacts:84; Gender:Plug; Contact Plating:Gold; No. of Rows:2; Contact Termination:Surface Mount Vertical; Contact Material:Phosphor Bronze
***Store
1FHP,84,30A/S,S,N,S10,12,13,15 PCB Connector Assembly Type: PCB Mount Header PCB Mount Orientation: Vertical Connector System: Board-to-Board Number of Positions: 84 Centerline (Pitch): .039 in PCB Mount Header Vertical Board-to-Board 84 | Free Height Plug Connector: Board-Board & Vertical & 84 & 1Mm | Part Number: 5120527-2 | Internal Number: 5120527-2 | .039"
Parte # Mfg. Descripción Valores Precio
FTMH-159-03-L-DV
DISTI # SAM1131-59-ND		Samtec IncCONN HEADER SMD 118POS 1MM
RoHS: Compliant
Min Qty: 1
Container: Bulk		Temporarily Out of Stock
  • 500:$10.0744
  • 250:$10.7692
  • 100:$11.8113
  • 50:$12.5062
  • 25:$13.5484
  • 10:$13.8960
  • 1:$15.2900
Imagen Parte # Descripción
FTMH-159-03-L-DV

Mfr.#: FTMH-159-03-L-DV

OMO.#: OMO-FTMH-159-03-L-DV-SAMTEC

 CONN HEADER SMD 118POS 1MM
Disponibilidad
Valores:
Available
En orden:
1500
Ingrese la cantidad:
El precio actual de FTMH-159-03-L-DV es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
Precio de referencia (USD)
Cantidad
Precio unitario
Ext. Precio
1
0,00 US$
0,00 US$
10
0,00 US$
0,00 US$
100
0,00 US$
0,00 US$
500
0,00 US$
0,00 US$
1000
0,00 US$
0,00 US$
Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
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