DH8900CC S LJW2

DH8900CC S LJW2
Mfr. #:
DH8900CC S LJW2
Fabricante:
Intel
Descripción:
Chipsets 8900 Chipset Server FCBGA-942
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
DH8900CC S LJW2 Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Más información:
DH8900CC S LJW2 más información
Atributo del producto
Valor de atributo
Fabricante:
Intel
Categoria de producto:
Conjuntos de chips
RoHS:
Y
Serie:
8900
Producto:
Chipsets de servidor
Serie de chipset:
8900
Escribe:
PCH
Nombre clave:
Cave Creek
Opciones integradas:
Incrustado
Revisión de PCIe:
1.0
Configuraciones de PCIe:
4 Lanes
Gráficos integrados:
Sin gráficos
Cantidad de puertos USB:
6
Número de puertos SATA:
2
TDP - Máx:
8.5 W
Temperatura máxima de funcionamiento:
+ 103 C
Paquete / Caja:
FCBGA-942
Embalaje:
Bandeja
Longitud:
27 mm
Ancho:
27 mm
Marca:
Intel
Estilo de montaje:
SMD / SMT
Configuración de CPU - Máx:
2
Sensible a la humedad:
Yes
Tipo de producto:
Conjuntos de chips
Cantidad de paquete de fábrica:
1
Subcategoría:
Conjuntos de chips
Revisión USB:
2.0
Parte # Alias:
923820
Tags
DH8900CCS, DH8900C, DH8900, DH890, DH89, DH8
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
Communication Chipset 942-Pin FC-BGA Tray
***ical
Communications Chip 942-Pin FCBGA Tray
*** Electronic Components
Chipsets 8900 Chipset Server FCBGA-942
Server Chipsets
Intel's Server Chipsets provides extensive I/O support with functions and capabilities that include PCI Express, PCI Local Bus, ACPI power management, enhanced DMA controller, Serial ATA, USB host interface, integrated 10/100/1000 Gigabit Ethernet MAC, and system management bus (SMBus) with additional support for I2C devices. These chipsets provide support for Intel High Definition Audio, Rapid Storage Technology, Active Management Technology, Virtualization Technology for Directed I/O, Trusted Execution Technology, Flexible Display Interconnect, Anti-Theft Technology, and JTAG Boundary Scan support.Learn More
89xx Communication Chipsets
Intel's 89xx Communication Chipsets are a platform controller hub (PCH) that includes standard PC interfaces (e.g., PCI Express, SATA, USB, etc.) along with Intel QuickAssist Technology and I/O interfaces. The PCH can be accessed by the IA processor via two interfaces: a DMI interface that provides connectivity to the standard PC interfaces and a PCI Express interface that provides connectivity to the PCH's PCI Express End Point (EP) for Intel QuickAssist Technology and access to the GbE MACs. These interfaces are not dependent on one another and can be used independently in a system.Learn More
Parte # Mfg. Descripción Valores Precio
DH8900CCS LJW2
DISTI # V99:2348_07313339
Intel CorporationPlatform Controller Hub Tray
RoHS: Compliant
1
  • 200:$43.3800
  • 50:$44.8000
  • 10:$46.3000
  • 1:$47.8900
DH8900CC S LJW2
DISTI # C1S325900208823
Intel CorporationCommunications Chipset Tray
RoHS: Compliant
1
  • 1:$47.8900
DH8900CC SLJW2
DISTI # DH8900CCS LJW2
Intel CorporationCommunication Chipset 942-Pin FC-BGA Tray - Trays (Alt: DH8900CCS LJW2)
RoHS: Compliant
Min Qty: 1
Container: Tray
Americas - 0
  • 1:$47.5900
  • 10:$46.9900
  • 25:$46.3900
  • 50:$45.7900
  • 100:$45.1900
  • 500:$44.5900
  • 1000:$43.9900
DH8900CC S LJW2
DISTI # 607-DH8900CCSLJW2
Intel CorporationChipsets 8900 Chipset Server FCBGA-942
RoHS: Compliant
7
  • 1:$49.2900
  • 10:$47.9400
  • 50:$46.6600
Imagen Parte # Descripción
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Pin Fin, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum, Black Anodized
904-27-2-12-2-B-0

Mfr.#: 904-27-2-12-2-B-0

OMO.#: OMO-904-27-2-12-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0-WAKEFIELD

HEATSINK 27X27X12MM ELLIPTICAL
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0-WAKEFIELD

Elliptical Fin Heat Sink
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
Disponibilidad
Valores:
Available
En orden:
1989
Ingrese la cantidad:
El precio actual de DH8900CC S LJW2 es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
Precio de referencia (USD)
Cantidad
Precio unitario
Ext. Precio
1
49,29 US$
49,29 US$
10
47,94 US$
479,40 US$
50
46,66 US$
2 333,00 US$
200
45,45 US$
9 090,00 US$
Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
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