SLJ32PCA012U5MFC66XHSA2

SLJ32PCA012U5MFC66XHSA2
Mfr. #:
SLJ32PCA012U5MFC66XHSA2
Fabricante:
Infineon Technologies AG
Descripción:
PAYMENT - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SLJ32PCA012U5MFC66XHSA2)
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
SLJ32PCA012U5MFC66XHSA2 Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Atributo del producto
Valor de atributo
Tags
SLJ32PCA012, SLJ32PCA, SLJ32PC, SLJ32P, SLJ32, SLJ3, SLJ
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
Parte # Mfg. Descripción Valores Precio
SLJ32PCA012U5MFC66XHSA2
DISTI # SLJ32PCA012U5MFC66XHSA2
Infineon Technologies AGPAYMENT - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SLJ32PCA012U5MFC66XHSA2)
RoHS: Compliant
Min Qty: 50000
Container: Waffle Pack
Americas - 0
    Imagen Parte # Descripción
    SLJ32PCA012U5MFC66PXHSA2

    Mfr.#: SLJ32PCA012U5MFC66PXHSA2

    OMO.#: OMO-SLJ32PCA012U5MFC66PXHSA2-1190

    PAYMENT - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SLJ32PCA012U5MFC66PXHSA2)
    SLJ32PCA012U5MFC66XHSA2

    Mfr.#: SLJ32PCA012U5MFC66XHSA2

    OMO.#: OMO-SLJ32PCA012U5MFC66XHSA2-1190

    PAYMENT - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SLJ32PCA012U5MFC66XHSA2)
    SLJ32PCA012U5MFC68PXHSA1

    Mfr.#: SLJ32PCA012U5MFC68PXHSA1

    OMO.#: OMO-SLJ32PCA012U5MFC68PXHSA1-1190

    PAYMENT - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SLJ32PCA012U5MFC68PXHSA1)
    SLJ32PCA012U5MFC68XHSA1

    Mfr.#: SLJ32PCA012U5MFC68XHSA1

    OMO.#: OMO-SLJ32PCA012U5MFC68XHSA1-1190

    PAYMENT - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SLJ32PCA012U5MFC68XHSA1)
    Disponibilidad
    Valores:
    Available
    En orden:
    3000
    Ingrese la cantidad:
    El precio actual de SLJ32PCA012U5MFC66XHSA2 es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
    Precio de referencia (USD)
    Cantidad
    Precio unitario
    Ext. Precio
    1
    0,00 US$
    0,00 US$
    10
    0,00 US$
    0,00 US$
    100
    0,00 US$
    0,00 US$
    500
    0,00 US$
    0,00 US$
    1000
    0,00 US$
    0,00 US$
    Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
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