ZSC31150GEC

ZSC31150GEC
Mfr. #:
ZSC31150GEC
Fabricante:
IDT, Integrated Device Technology Inc
Descripción:
DICE (WAFER SAWN) - FRAME
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
ZSC31150GEC Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Atributo del producto
Valor de atributo
Tags
ZSC31150GE, ZSC31150G, ZSC311, ZSC31, ZSC3, ZSC
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et Europe
Fast Automotive Sensor Signal Conditioner -40 to 150°C Die Sawn on Wafer Frame
***egrated Device Technology
Automotive Sensor Signal Conditioner
***i-Key
DICE (WAFER SAWN) - FRAME
Parte # Mfg. Descripción Valores Precio
ZSC31150GEC
DISTI # ZSC31150GEC-ND
Integrated Device Technology IncDICE (WAFER SAWN) - FRAME
RoHS: Not compliant
Min Qty: 2800
Container: Tray
Temporarily Out of Stock
  • 2800:$3.1787
ZSC31150GEC
DISTI # ZSC31150GEC
Integrated Device Technology IncFast Automotive Sensor Signal Conditioner -40 to 150°C Die Sawn on Wafer Frame (Alt: ZSC31150GEC)
RoHS: Compliant
Min Qty: 1
Europe - 0
  • 1:€3.7900
  • 10:€3.3900
  • 25:€3.2900
  • 50:€3.1900
  • 100:€2.9900
  • 500:€2.8900
  • 1000:€2.6900
ZSC31150GEC
DISTI # ZSC31150GEC
Integrated Device Technology IncFast Automotive Sensor Signal Conditioner -40 to 150°C Die Sawn on Wafer Frame - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSC31150GEC)
RoHS: Compliant
Min Qty: 2800
Container: Waffle Pack
Americas - 0
  • 2800:$3.6900
  • 5600:$3.4900
  • 11200:$3.2900
  • 16800:$3.0900
  • 28000:$2.9900
Imagen Parte # Descripción
ZSC31150GEG1-R

Mfr.#: ZSC31150GEG1-R

OMO.#: OMO-ZSC31150GEG1-R

Sensor Interface Sensor Signal Conditioner
ZSC31150GAG2-V

Mfr.#: ZSC31150GAG2-V

OMO.#: OMO-ZSC31150GAG2-V

Sensor Interface DFN / 14 / 5x4mm# SF - tray
ZSC31010CEB

Mfr.#: ZSC31010CEB

OMO.#: OMO-ZSC31010CEB-1190

WAFER (UNSAWN) - BOX
ZSC31014BOARDV2P1S

Mfr.#: ZSC31014BOARDV2P1S

OMO.#: OMO-ZSC31014BOARDV2P1S-1190

SSC BOARD ZSC31014 V2.1 WITH SAM
ZSC31015EIB

Mfr.#: ZSC31015EIB

OMO.#: OMO-ZSC31015EIB-1190

WAFER (UNSAWN) - BOX
ZSC31050FED

Mfr.#: ZSC31050FED

OMO.#: OMO-ZSC31050FED-1190

DICE (WAFER SAWN) - WAFFLE PACK
ZSC31050FIG1-T

Mfr.#: ZSC31050FIG1-T

OMO.#: OMO-ZSC31050FIG1-T-INTEGRATED-DEVICE-TECH

Data Converter Systems Adv Diff Sensor Signal Conditione
ZSC31150GEG1-T

Mfr.#: ZSC31150GEG1-T

OMO.#: OMO-ZSC31150GEG1-T-INTEGRATED-DEVICE-TECH

Data Converter Systems Sensor Signal Conditione
ZSC31150GEG2-R

Mfr.#: ZSC31150GEG2-R

OMO.#: OMO-ZSC31150GEG2-R-INTEGRATED-DEVICE-TECH

Sensor Interface Sensor Signal Condtr -40C to 150C
ZSC31014EIB

Mfr.#: ZSC31014EIB

OMO.#: OMO-ZSC31014EIB-1190

WAFER (UNSAWN) - BOX
Disponibilidad
Valores:
Available
En orden:
4500
Ingrese la cantidad:
El precio actual de ZSC31150GEC es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
Precio de referencia (USD)
Cantidad
Precio unitario
Ext. Precio
1
4,48 US$
4,48 US$
10
4,26 US$
42,61 US$
100
4,04 US$
403,65 US$
500
3,81 US$
1 906,15 US$
1000
3,59 US$
3 588,00 US$
Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
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