WAVE-29-127

WAVE-29-127
Mfr. #:
WAVE-29-127
Fabricante:
Wakefield-Vette
Descripción:
Heat Sinks Wave Series Low Profile Heatsink BGA Chipset Aluminum Top Mount, 29x29x12.7mm
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
WAVE-29-127 Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Atributo del producto
Valor de atributo
Fabricante:
Wakefield-Vette
Categoria de producto:
Disipadores de calor
RoHS:
Y
Producto:
Disipadores de calor
Estilo de montaje:
Acortar
Material del disipador de calor:
Aluminio
Diseñado para:
Semiconductores BGA
Color:
Negro
Serie:
BGA
Marca:
Wakefield-Vette
Altura en:
-
Altura - mm:
-
Longitud - en:
-
Longitud - mm:
-
Tipo de producto:
Disipadores de calor
Cantidad de paquete de fábrica:
1000
Subcategoría:
Disipadores de calor
Nombre comercial:
Ola
Ancho - en:
-
Ancho - mm:
-
Unidad de peso:
0.515000 oz
Tags
WAVE-2, WAVE, WAV
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ark
Low Profile Heat Sink Bga Chipset Aluminum Top Mount
***i-Key
ANCHOR HEATSINK 29X29X12.7MM
***hardson RFPD
BOARD LEVEL HEAT SINK
Imagen Parte # Descripción
978-025-010R031

Mfr.#: 978-025-010R031

OMO.#: OMO-978-025-010R031

D-Sub Backshells 25P TOP ENTRY GREY PLASTIC
DB25S064HTLF

Mfr.#: DB25S064HTLF

OMO.#: OMO-DB25S064HTLF

D-Sub Standard Connectors 25P SOCKET SOLDER BUCKET
WAVE-23-165

Mfr.#: WAVE-23-165

OMO.#: OMO-WAVE-23-165

Heat Sinks Wave Series Low Profile Heatsink BGA Chipset Aluminum Top Mount, 23x23x16.5mm
WAVE-ANC2

Mfr.#: WAVE-ANC2

OMO.#: OMO-WAVE-ANC2

Heat Sinks Wave Series Assembly, Solder Anchor
DB25S064HTLF

Mfr.#: DB25S064HTLF

OMO.#: OMO-DB25S064HTLF-AMPHENOL-ICC

D-Sub Standard Connectors 25P SOCKET SOLDER BUCKET
978-025-010R031

Mfr.#: 978-025-010R031

OMO.#: OMO-978-025-010R031-NORCOMP

D-Sub Backshells 25P TOP ENTRY GREY PLASTIC
Disponibilidad
Valores:
956
En orden:
2939
Ingrese la cantidad:
El precio actual de WAVE-29-127 es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
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