ZSC31050FIC

ZSC31050FIC
Mfr. #:
ZSC31050FIC
Fabricante:
IDT, Integrated Device Technology Inc
Descripción:
DICE (WAFER SAWN) - FRAME
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
ZSC31050FIC Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Atributo del producto
Valor de atributo
Tags
ZSC31050FI, ZSC31050F, ZSC3105, ZSC310, ZSC31, ZSC3, ZSC
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***egrated Device Technology
Advanced Differential Sensor Signal Conditioner with Multiple Output Options
***et
Advanced Differential Sensor Signal Conditioner -25 to 85°C Die Sawn on Wafer Frame
***i-Key
DICE (WAFER SAWN) - FRAME
Parte # Mfg. Descripción Valores Precio
ZSC31050FIC
DISTI # ZSC31050FIC-ND
Integrated Device Technology IncDICE (WAFER SAWN) - FRAME
RoHS: Not compliant
Min Qty: 2900
Container: Tray
Temporarily Out of Stock
  • 2900:$3.5100
ZSC31050FIC
DISTI # ZSC31050FIC
Integrated Device Technology IncAdvanced Differential Sensor Signal Conditioner -25 to 85°C Die Sawn on Wafer Frame (Alt: ZSC31050FIC)
RoHS: Compliant
Min Qty: 1
Europe - 0
  • 1000:€3.0900
  • 500:€3.3900
  • 100:€3.4900
  • 50:€3.5900
  • 25:€3.7900
  • 10:€3.8900
  • 1:€4.2900
ZSC31050FIC
DISTI # ZSC31050FIC
Integrated Device Technology IncAdvanced Differential Sensor Signal Conditioner -25 to 85°C Die Sawn on Wafer Frame - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSC31050FIC)
RoHS: Compliant
Min Qty: 2900
Container: Waffle Pack
Americas - 0
  • 29000:$3.3900
  • 17400:$3.4900
  • 11600:$3.6900
  • 5800:$3.8900
  • 2900:$4.1900
Imagen Parte # Descripción
ZSC31014EIG1-R

Mfr.#: ZSC31014EIG1-R

OMO.#: OMO-ZSC31014EIG1-R

Sensor Interface Sensor Signal Conditoner
ZSC31050FED

Mfr.#: ZSC31050FED

OMO.#: OMO-ZSC31050FED

Sensor Interface Differential Sensor Signal Conditioner
ZSC31010CIC

Mfr.#: ZSC31010CIC

OMO.#: OMO-ZSC31010CIC-1190

DICE (WAFER SAWN) - FRAME
ZSC31014BOARDV2P1S

Mfr.#: ZSC31014BOARDV2P1S

OMO.#: OMO-ZSC31014BOARDV2P1S-1190

SSC BOARD ZSC31014 V2.1 WITH SAM
ZSC31015EEC

Mfr.#: ZSC31015EEC

OMO.#: OMO-ZSC31015EEC-1190

DICE (WAFER SAWN) - FRAME
ZSC31015EIB

Mfr.#: ZSC31015EIB

OMO.#: OMO-ZSC31015EIB-1190

WAFER (UNSAWN) - BOX
ZSC31150MCREFBV1P0

Mfr.#: ZSC31150MCREFBV1P0

OMO.#: OMO-ZSC31150MCREFBV1P0-1190

ZSC31150 MASS CALIBR. REF. BOARD
ZSC31015EAG1-T

Mfr.#: ZSC31015EAG1-T

OMO.#: OMO-ZSC31015EAG1-T-INTEGRATED-DEVICE-TECH

Data Converter Systems Sensor Signal Conditione
ZSC31150GEG2-R

Mfr.#: ZSC31150GEG2-R

OMO.#: OMO-ZSC31150GEG2-R-INTEGRATED-DEVICE-TECH

Sensor Interface Sensor Signal Condtr -40C to 150C
ZSC31050FAG1

Mfr.#: ZSC31050FAG1

OMO.#: OMO-ZSC31050FAG1-1190

Nuevo y original
Disponibilidad
Valores:
Available
En orden:
3000
Ingrese la cantidad:
El precio actual de ZSC31050FIC es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
Precio de referencia (USD)
Cantidad
Precio unitario
Ext. Precio
1
5,08 US$
5,08 US$
10
4,83 US$
48,31 US$
100
4,58 US$
457,65 US$
500
4,32 US$
2 161,15 US$
1000
4,07 US$
4 068,00 US$
Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
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