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Quality GuaranteesWe provide 90-360 days warranty.
If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.
we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.
Email: [email protected]
| Parte # | Mfg. | Descripción | Valores | Precio |
|---|---|---|---|---|
| PL-2-3-254 DISTI # 345-1515-ND | Wakefield-Vette | THERM PAD 25.4MMX25.4MM GREEN Min Qty: 1 Container: Bulk | 1280In Stock |
|
| PL-2-3-254-H DISTI # 345-1513-ND | Wakefield-Vette | THERM PAD 25.4MMX25.4MM GREEN Min Qty: 1 Container: Bulk | 213In Stock |
|
| PL-2-3-254 DISTI # 12AC7721 | Wakefield-Vette | THERMAL PAD, 25.4X25.4MM, 2MM,Thickness:2mm,Conductive Material:Silicone,Thermal Conductivity:3W/m.K,Thermal Impedance:-,Volume Resistivity:-,External Length:25.4mm,External Width:25.4mm,Product Range:ulTIMiFlux Series RoHS Compliant: Yes RoHS: Compliant | 0 |
|
| PL-2-3-254-H DISTI # 12AC7722 | Wakefield-Vette | THERMAL PAD, 25.4X25.4MM, 2MM,Thickness:2mm,Conductive Material:Silicone,Thermal Conductivity:3W/m.K,Thermal Impedance:-,Volume Resistivity:-,External Length:25.4mm,External Width:25.4mm,Product Range:ulTIMiFlux Series RoHS Compliant: Yes RoHS: Compliant | 0 |
|
| PL-2-3-254 DISTI # 567-PL-2-3-254 | Wakefield-Vette | Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green RoHS: Compliant | 738 |
|
| PL-2-3-254-H DISTI # 567-PL-2-3-254-H | Wakefield-Vette | Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft RoHS: Compliant | 235 |
|
| PL-2-3-254 DISTI # PL-2-3-254 | Wakefield-Vette | THERMAL ADHESIVE/COMPOUND/MATERIAL RoHS: Compliant | 0 |
|
| PL-2-3-254-H DISTI # PL-2-3-254-H | Wakefield-Vette | THERMAL ADHESIVE/COMPOUND/MATERIAL RoHS: Compliant | 0 |
|
| PL-2-3-254 DISTI # 000000000005591527 | Wakefield-Vette | Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green | 0 |
|
| PL-2-3-254-H DISTI # 000000000005591528 | Wakefield-Vette | Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft | 0 |
|
| Imagen | Parte # | Descripción |
|---|---|---|
|
Mfr.#: MT29F2G01ABBGDWB-IT:G TR OMO.#: OMO-MT29F2G01ABBGDWB-IT-G-TR |
NAND Flash SLC 2G 2GX1 UPDFN |
|
|
Mfr.#: MT29F4G01ADAGDWB-IT:G TR OMO.#: OMO-MT29F4G01ADAGDWB-IT-G-TR |
NAND Flash SLC 4G 4GX1 UPDFN DDP |
|
Mfr.#: PL-1-3-254 OMO.#: OMO-PL-1-3-254 |
Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 1.0mm Thickness, 25.4x25.4mm, Green |
|
Mfr.#: 108-0910-001 OMO.#: OMO-108-0910-001-BEL |
Banana Plug |
|
Mfr.#: MT29F2G01ABBGDWB-IT:G TR |
SLC 2G 2GX1 UPDFN |
|
|
Mfr.#: MT29F4G01ADAGDWB-IT:G TR |
SLC 4G 4GX1 UPDFN DDP |
