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SIGC223T120R2CLX1SA1

SIGC223T120R2CLX1SA1
Mfr. #:
SIGC223T120R2CLX1SA1
Fabricante:
Infineon Technologies AG
Descripción:
Trans IGBT Chip N-CH 1.2KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC223T120R2CLX1SA1)
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
SIGC223T120R2CLX1SA1 Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Atributo del producto
Valor de atributo
Tags
SIGC2, SIGC, SIG
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
Trans IGBT Chip N-CH 1.2KV DIE
***ineon
Infineon's IGBT 2 family is a non punch-through IGBT technology with low switching losses and high robustness. | Summary of Features: Positive temperature coefficient; Easy paralleling; High robustness | Target Applications: Medium / high power drives
Parte # Mfg. Descripción Valores Precio
SIGC223T120R2CLX1SA1
DISTI # SIGC223T120R2CLX1SA1		Infineon Technologies AGTrans IGBT Chip N-CH 1.2KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC223T120R2CLX1SA1)
RoHS: Compliant
Min Qty: 18
Container: Waffle Pack		Americas - 0
  • 18:$20.4900
  • 20:$19.6900
  • 38:$18.9900
  • 90:$18.3900
  • 180:$18.0900
Imagen Parte # Descripción
SIGC223T120R2CLX1SA1

Mfr.#: SIGC223T120R2CLX1SA1

OMO.#: OMO-SIGC223T120R2CLX1SA1-1190

 Trans IGBT Chip N-CH 1.2KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC223T120R2CLX1SA1)
SIGC223T120R2CSX1SA3

Mfr.#: SIGC223T120R2CSX1SA3

OMO.#: OMO-SIGC223T120R2CSX1SA3-1190

 IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC223T120R2CSX1SA3)
Disponibilidad
Valores:
Available
En orden:
5000
Ingrese la cantidad:
El precio actual de SIGC223T120R2CLX1SA1 es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
Precio de referencia (USD)
Cantidad
Precio unitario
Ext. Precio
1
27,14 US$
27,14 US$
10
25,78 US$
257,78 US$
100
24,42 US$
2 442,15 US$
500
23,06 US$
11 532,40 US$
1000
21,71 US$
21 708,00 US$
Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
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