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2227MC-08-03-18-F1

2227MC-08-03-18-F1
Mfr. #:
2227MC-08-03-18-F1
Fabricante:
SPC Multicomp
Descripción:
CONNECTOR, DIP SOCKET, 8 WAY, PC BOARD, No. of Contacts:8Contacts, Connector Type:DIP Socket, Pitch Spacing:2.54mm, Product Range:2227MC Series, Row Pitch:7.62mm, Contact Material:Phosphor Bronz
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
2227MC-08-03-18-F1 Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Atributo del producto
Valor de atributo
Tags
2227M, 2227, 222
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ment14 APAC
SOCKET IC, DIL, 0.3", 8WAY; No. of Contacts:8Contacts; Connector Type:DIP Socket; Pitch Spacing:2.54mm; Product Range:2227MC Series; Row
***roFlash
IC Socket, DIP8, 8 Contact(s)
***th Star Micro
SOCKET IC, DIL, 0.3, 8WAY
***nell
SOCKET IC, DIL, 0.3", 8WAY; No. of Contacts: 8Contacts; Connector Type: DIP Socket; Pitch Spacing: 2.54mm; Product Range: 2227MC Series; Row Pitch: 7.62mm; Contact Material: Phosphor Bronze; Contact Plating: Tin Plated Contacts; SVHC: No SVHC (15-Jan-2019); Connector Mounting Orientation: PC Board; Contact Termination: Through Hole Vertical; Contact Termination Type: Through Hole; External Depth: 7.4mm; External Length / Height: 10.16mm; External Width: 10.16mm; Insulation Resistance: 1000Mohm; Lead Spacing: 2.54mm; Operating Temperature Max: 125°C; Operating Temperature Min: -55°C; Pin Format: DIP; Tube Quantity: 1
Parte # Mfg. Descripción Valores Precio
2227MC-08-03-18-F1
DISTI # 98K7077		SPC MulticompCONNECTOR, DIP SOCKET, 8 WAY, PC BOARD,No. of Contacts:8Contacts,Connector Type:DIP Socket,Pitch Spacing:2.54mm,Product Range:2227MC Series,Row Pitch:7.62mm,Contact Material:Phosphor Bronze,Contact Plating:Tin Plated Contacts RoHS Compliant: Yes2173
  • 5000:$0.2210
  • 1000:$0.2420
  • 500:$0.2710
  • 250:$0.3030
  • 1:$0.4020
2227MC-08-03-18-F1
DISTI # 1103844		SPC MulticompSOCKET IC, DIL, 0.3", 8WAY
RoHS: Compliant		48773
  • 1500:£0.0855
  • 1000:£0.0901
  • 500:£0.1130
  • 150:£0.1320
  • 10:£0.1880
2227MC-08-03-18-F1
DISTI # 1103844		SPC MulticompSOCKET IC, DIL, 0.3", 8WAY
RoHS: Compliant		38007
  • 1000:$0.1810
  • 500:$0.2060
  • 250:$0.2340
  • 100:$0.2740
  • 1:$0.3150
Imagen Parte # Descripción
2227MC-08-03-18-F1

Mfr.#: 2227MC-08-03-18-F1

OMO.#: OMO-2227MC-08-03-18-F1-1190

 CONNECTOR, DIP SOCKET, 8 WAY, PC BOARD, No. of Contacts:8Contacts, Connector Type:DIP Socket, Pitch Spacing:2.54mm, Product Range:2227MC Series, Row Pitch:7.62mm, Contact Material:Phosphor Bronz
Disponibilidad
Valores:
Available
En orden:
5000
Ingrese la cantidad:
El precio actual de 2227MC-08-03-18-F1 es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
Precio de referencia (USD)
Cantidad
Precio unitario
Ext. Precio
1
0,33 US$
0,33 US$
10
0,31 US$
3,15 US$
100
0,30 US$
29,84 US$
500
0,28 US$
140,90 US$
1000
0,27 US$
265,20 US$
Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
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