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68020-404HLF

68020-404HLF
Mfr. #:
68020-404HLF
Fabricante:
Amphenol ICC (FCI)
Descripción:
Headers & Wire Housings 4P SR UNSHRD HRD TIN OVER NI
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
68020-404HLF Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
68020-404HLF Datasheet68020-404HLF Datasheet (P4-P5)
ECAD Model:
Atributo del producto
Valor de atributo
Tags
68020-404, 68020-40, 68020-4, 68020, 6802, 680
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
Conn Unshrouded Header HDR 4 POS 2.54mm Solder RA Thru-Hole Poly Bag
***henol ICC / FCI
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
***ark
68020-404HLF-B/S II DR R/A / 6000 ROHS COMPLIANT: YES
***erstate Connecting Components
L-845/722 Hex Wrench Installation Tool
***ical
Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST Top Entry Thru-Hole BergStik® Bulk
***ow.cn
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 4 Positions, 2.54 mm (0.100in) Pitch
***ark
BOARD TO BOARD, HEADER, 4 POSITION, 2ROW; Pitch Spacing:2.54mm; No. of Contacts:4Contacts; Gender:Header; Product Range:FCI BergStik 67997 Series; Contact Termination Type:Through Hole; No. of Rows:2Rows RoHS Compliant: Yes
***ical
Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST Top Entry Thru-Hole BergStik® Bulk
***nell
BTB CONN, HEADER, 4POS, 2ROW, 2.54MM; Connector Systems: Board-to-Board; Pitch Spacing: 2.54mm; No. of Rows: 2Rows; No. of Contacts: 4Contacts; Contact Termination Type: Through Hole; Product Range: FCI BergStik 67996 Series; Gender: Header
***henol ICC / FCI
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 4 Positions, 2.54 mm (0.100in) Pitch
***ical
Conn Unshrouded Header HDR 4 POS 2.54mm Solder RA Side Entry Thru-Hole BergStik® Bulk
***ark
68021-404HLF-BERG II DR RIGHT / Bag RoHS Compliant: Yes
***henol ICC / FCI
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 4 Positions, 2.54 mm (0.100in) Pitch.
***erstate Connecting Components
L-845/722 Hex Wrench Installation Tool
***ical
Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST Top Entry Thru-Hole C-Grid® Bag
***ex
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, Tin (Sn) Plating, 2.79mm PC Tail Length
***erstate Connecting Components
CGRID VT BKWY HDR TIN 4CKT (3 0/110)
***y Electronics
TSW - Samtec 2.54mm Right Angle Through Hole Header 2.29mm Solder Tail (08) - Fast Stock(mc)
***ical
Conn Unshrouded Header HDR 4 POS 2.54mm Solder RA Side Entry Thru-Hole Bulk
***nell
CONNECTOR, HEADER, 4POS, 2ROW, 2.54MM; Pitch Spacing: 2.54mm; No. of Contacts: 4Contacts; Gender: Header; Product Range: TSW Series; Contact Termination Type: Through Hole; No. of Rows: 2Rows; Contact Plating: Tin Plated Contacts; Contact Material: Phosphor Bronze; SVHC: No SVHC (15-Jan-2019)
***ical
Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST Top Entry Thru-Hole Bag
***ark
HEADER, 2.54MM, THOUGH HOLE VERTICAL, 4 POSITION; Connector Systems:Board-to-Board; Pitch Spacing:2.54mm; No. of Rows:2Rows; No. of Contacts:4Contacts; Contact Termination Type:Through Hole; Product Range:TSW Series RoHS Compliant: Yes
***nell
HEADER, 2.54MM, THT VERT, 4WAY; Pitch Spacing:2.54mm; No. of Contacts:4Contacts; Gender:Header; Product Range:TSW Series; Contact Termination Type:Through Hole; No. of Rows:2Rows; Contact Plating:Tin Plated Contacts; Contact Material:Phosphor Bronze; SVHC:No SVHC (15-Jan-2019); Contact Termination:Through Hole Vertical; Row Pitch:2.54mm
Parte # Mfg. Descripción Valores Precio
68020-404HLF
DISTI # 68020-404HLF-ND		Amphenol FCiCONN HEADER R/A 4POS 2.54MM
RoHS: Compliant
Min Qty: 6000
Container: Bag		Temporarily Out of Stock
  • 6000:$0.0941
68020-404HLF
DISTI # 68020-404HLF		Amphenol CorporationConn Unshrouded Header HDR 4 POS 2.54mm Solder RA Thru-Hole Poly Bag - Bag (Alt: 68020-404HLF)
RoHS: Compliant
Min Qty: 6000
Container: Bag		Americas - 0
  • 60000:$0.0739
  • 36000:$0.0749
  • 24000:$0.0759
  • 12000:$0.0779
  • 6000:$0.0799
68020-404HLF
DISTI # 20M2693		Amphenol ICC68020-404HLF-B/S II DR R/A / Bag RoHS Compliant: Yes0
  • 5000:$0.1390
  • 1000:$0.1520
  • 500:$0.1670
  • 250:$0.1860
  • 1:$0.2420
68020-404HLF
DISTI # 649-68020-404HLF		Amphenol FCiHeaders & Wire Housings 4P SR UNSHRD HRD TIN OVER NI
RoHS: Compliant		0
  • 1:$0.2400
  • 10:$0.1650
  • 100:$0.1530
  • 500:$0.1300
  • 1000:$0.1060
  • 2500:$0.0980
  • 5000:$0.0950
  • 10000:$0.0860
68020-404H
DISTI # 649-68020-404H		Amphenol FCiHeaders & Wire Housings Bergstik Unshrouded Header0
    68020-404HLF
    DISTI # BRG68020-404HLF    		Amphenol FCiB/S II DR R/AAmericas - 0
      68020-404HLF
      DISTI # BRG68020-404HLF      		Amphenol FCiB/S II DR R/A0
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        Disponibilidad
        Valores:
        Available
        En orden:
        3000
        Ingrese la cantidad:
        El precio actual de 68020-404HLF es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
        Precio de referencia (USD)
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        Ext. Precio
        1
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        10
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        100
        0,00 US$
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        500
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        1000
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        Debido a la escasez de semiconductores a partir de 2021, el precio inferior es el precio normal antes de 2021. Envíe una consulta para confirmar.
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