SIGC81T120R2C

SIGC81T120R2C
Mfr. #:
SIGC81T120R2C
Fabricante:
Infineon Technologies AG
Descripción:
Ciclo vital:
Nuevo de este fabricante.
Ficha de datos:
SIGC81T120R2C Ficha de datos
Entrega:
DHL FedEx Ups TNT EMS
Pago:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Atributo del producto
Valor de atributo
Tags
SIGC81T1, SIGC81, SIGC8, SIGC, SIG
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
Parte # Mfg. Descripción Valores Precio
SIGC81T120R2CX1SA2
DISTI # SIGC81T120R2CX1SA2
Infineon Technologies AGIGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC81T120R2CX1SA2)
RoHS: Compliant
Min Qty: 49
Container: Waffle Pack
Americas - 0
  • 490:$6.5900
  • 245:$6.6900
  • 147:$6.8900
  • 98:$7.1900
  • 49:$7.3900
SIGC81T120R2CX1SA2
DISTI # SP000012063
Infineon Technologies AGIGBT CHIPS (Alt: SP000012063)
RoHS: Compliant
Min Qty: 1
Europe - 0
  • 1000:€5.5900
  • 500:€5.6900
  • 100:€5.8900
  • 50:€6.0900
  • 25:€6.2900
  • 10:€6.9900
  • 1:€8.5900
SIGC81T120R2CLX1SA2
DISTI # SIGC81T120R2CLX1SA2
Infineon Technologies AGTrans IGBT Chip N-CH 1.2KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC81T120R2CLX1SA2)
RoHS: Compliant
Min Qty: 50
Container: Waffle Pack
Americas - 0
  • 500:$6.3900
  • 250:$6.4900
  • 150:$6.7900
  • 100:$6.9900
  • 50:$7.2900
SIGC81T120R2CSX1SA4
DISTI # SIGC81T120R2CSX1SA4
Infineon Technologies AGIGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC81T120R2CSX1SA4)
RoHS: Compliant
Min Qty: 49
Container: Waffle Pack
Americas - 0
  • 490:$6.5900
  • 245:$6.6900
  • 147:$6.8900
  • 98:$7.1900
  • 49:$7.3900
SIGC81T120R2CLX1SA2
DISTI # SP000012070
Infineon Technologies AGTrans IGBT Chip N-CH 1.2KV DIE (Alt: SP000012070)
RoHS: Compliant
Min Qty: 1
Europe - 0
  • 1000:€5.5900
  • 100:€5.6900
  • 500:€5.6900
  • 50:€5.7900
  • 25:€6.0900
  • 10:€6.1900
  • 1:€6.3900
Imagen Parte # Descripción
SIGC81T120R2CLX1SA2

Mfr.#: SIGC81T120R2CLX1SA2

OMO.#: OMO-SIGC81T120R2CLX1SA2-1190

Trans IGBT Chip N-CH 1.2KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC81T120R2CLX1SA2)
SIGC81T120R2CSX1SA4

Mfr.#: SIGC81T120R2CSX1SA4

OMO.#: OMO-SIGC81T120R2CSX1SA4-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC81T120R2CSX1SA4)
SIGC81T120R2CX1SA2

Mfr.#: SIGC81T120R2CX1SA2

OMO.#: OMO-SIGC81T120R2CX1SA2-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC81T120R2CX1SA2)
SIGC81T60NCX1SA3

Mfr.#: SIGC81T60NCX1SA3

OMO.#: OMO-SIGC81T60NCX1SA3-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC81T60NCX1SA3)
SIGC81T60SNCX1SA1

Mfr.#: SIGC81T60SNCX1SA1

OMO.#: OMO-SIGC81T60SNCX1SA1-1190

Trans IGBT Chip N-CH 600V DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC81T60SNCX1SA1)
SIGC81T120R2C

Mfr.#: SIGC81T120R2C

OMO.#: OMO-SIGC81T120R2C-1190

Nuevo y original
Disponibilidad
Valores:
Available
En orden:
4500
Ingrese la cantidad:
El precio actual de SIGC81T120R2C es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]
Precio de referencia (USD)
Cantidad
Precio unitario
Ext. Precio
1
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0,00 US$
10
0,00 US$
0,00 US$
100
0,00 US$
0,00 US$
500
0,00 US$
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1000
0,00 US$
0,00 US$
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