We guarantee 100% customer satisfaction.
Quality GuaranteesWe provide 90-360 days warranty.
If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.
we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.
Email: [email protected]
| Parte # | Mfg. | Descripción | Valores | Precio |
|---|---|---|---|---|
| SIGC156T60NR2CX1SA4 DISTI # SIGC156T60NR2CX1SA4 | Infineon Technologies AG | Trans IGBT Chip N-CH 600V DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC156T60NR2CX1SA4) RoHS: Compliant Min Qty: 26 Container: Waffle Pack | Americas - 0 |
|
| SIGC156T60NR2CX1SA4 DISTI # SP000012818 | Infineon Technologies AG | Trans IGBT Chip N-CH 600V DIE (Alt: SP000012818) RoHS: Compliant Min Qty: 1 | Europe - 0 |
|
| Imagen | Parte # | Descripción |
|---|---|---|
|
Mfr.#: SIGC156T60NR2CX1SA4 OMO.#: OMO-SIGC156T60NR2CX1SA4-1190 |
Trans IGBT Chip N-CH 600V DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC156T60NR2CX1SA4) |
|
|
Mfr.#: SIGC156T60NR2CYX1SA1 |
IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC156T60NR2CYX1SA1) |
|
|
Mfr.#: SIGC156T60SNR2CX1SA1 |
IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC156T60SNR2CX1SA1) |
