XCKU11P-3FFVD900E

Mfr. #:: XCKU11P-3FFVD900E
Fabricante:: Xilinx
Descripción:: FPGA - Field Programmable Gate Array
Ciclo vital:: Nuevo de este fabricante.
Ficha de datos:: XCKU11P-3FFVD900E Ficha de datos
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Más información:: XCKU11P-3FFVD900E más información XCKU11P-3FFVD900E Product Details

Atributo del producto
Valor de atributo

Fabricante:: Xilinx

Categoria de producto:: FPGA - Arreglo de puerta programable en campo

RoHS:: Y

Producto:: Kintex UltraScale +

Número de elementos lógicos:: 653100

Número de E / S:: 424 I/O

Voltaje de suministro operativo:: 0.85 V

Temperatura mínima de funcionamiento:: 0 C

Temperatura máxima de funcionamiento:: + 100 C

Estilo de montaje:: SMD / SMT

Paquete / Caja:: FBGA-900

Velocidad de datos:: 32.75 Gb/s

Serie:: XCKU11P

Marca:: Xilinx

RAM distribuida:: 9.1 Mbit

RAM de bloque integrado - EBR:: 21.1 Mbit

Número de transceptores:: 52 Transceiver

Tipo de producto:: FPGA - Arreglo de puerta programable en campo

Cantidad de paquete de fábrica:: 1

Subcategoría:: Circuitos integrados de lógica programable

Nombre comercial:: Kintex UltraScale +

Tags: XCKU11P-3, XCKU11P, XCKU11, XCKU1, XCKU, XCK

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

XCKU11P-3FFVD900E Más información

Kintex® UltraScale+ Field Programmable Gate Arrays: Xilinx Kintex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Kintex UltraScale+ devices are ideal for both packet processing and DSP-intensive functions, and for applications ranging from wireless MIMO technology to Nx100G networking and data center.

Market price

Parte #	Mfg.	Descripción	Valores	Precio
XCKU11P-3FFVD900E DISTI # XCKU11P-3FFVD900E-ND	Xilinx	XCKU11P-3FFVD900E RoHS: Compliant Min Qty: 1 Container: Tray	Temporarily Out of Stock	1:$4,206.6000
XCKU11P-3FFVD900E DISTI # XCKU11P-3FFVD900E	Xilinx	XCKU11P-3FFVD900E - Trays (Alt: XCKU11P-3FFVD900E) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0	1:$4,275.0000

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	Mfr.#: XCKU11P-2FFVD900E OMO.#: OMO-XCKU11P-2FFVD900E	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU11P-2FFVD900I OMO.#: OMO-XCKU11P-2FFVD900I	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU11P-L1FFVE1517I OMO.#: OMO-XCKU11P-L1FFVE1517I	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU11P-1FFVA1156E OMO.#: OMO-XCKU11P-1FFVA1156E-XILINX	XCKU11P-1FFVA1156E
	Mfr.#: XCKU11P-2FFVA1156E OMO.#: OMO-XCKU11P-2FFVA1156E-XILINX	XCKU11P-2FFVA1156E
	Mfr.#: XCKU11P-2FFVA1156I OMO.#: OMO-XCKU11P-2FFVA1156I-XILINX	XCKU11P-2FFVA1156I
	Mfr.#: XCKU11P-2FFVD900E OMO.#: OMO-XCKU11P-2FFVD900E-XILINX	XCKU11P-2FFVD900E
	Mfr.#: XCKU11P-3FFVD900E OMO.#: OMO-XCKU11P-3FFVD900E-XILINX	XCKU11P-3FFVD900E
	Mfr.#: XCKU11P-L1FFVA1156I OMO.#: OMO-XCKU11P-L1FFVA1156I-XILINX	XCKU11P-L1FFVA1156I
	Mfr.#: XCKU11P-L2FFVA1156E OMO.#: OMO-XCKU11P-L2FFVA1156E-XILINX	XCKU11P-L2FFVA1156E

Disponibilidad

Valores:: Available
En orden:: 5500
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El precio actual de XCKU11P-3FFVD900E es solo de referencia, si desea obtener el mejor precio, envíe una consulta o envíe un correo electrónico directo a nuestro equipo de ventas [email protected]

Precio de referencia (USD)

Cantidad
Precio unitario
Ext. Precio

1: ~~4 014,26 US$~~; ~~4 014,26 US$~~

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XCKU11P-3FFVD900E

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes