Disipadores de calor
| Imagen | Parte # | Descripción | Fabricante | Serie | RFQ |
|---|---|---|---|---|---|
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Mfr.#: 901-10-1-18-2-B-0 OMO.#: OMO-901-10-1-18-2-B-0 |
Heat Sinks Chipset Heatsink with Clip, Elliptical, 19mm Chip Size, 17.6mm Height, Aluminum, Black Anodized | Wakefield-Vette | 901 | |
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Mfr.#: 302MM OMO.#: OMO-302MM |
Heat Sinks Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x38.1mm, (2) 10-32UNF, 0.625 Inch Thread Depth | Wakefield-Vette | 302 | |
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Mfr.#: 1542614-2 OMO.#: OMO-1542614-2 |
Heat Sinks HS PLTD | TE Connectivity | None | |
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Mfr.#: 578205B00000G OMO.#: OMO-578205B00000G |
Heat Sinks Snap-On Cooler Heatsink for TO-5, Vertical Mounting, 38 n Thermal Resistance, Black Anodized, 6.35mm | Aavid, Thermal Division of Boyd Corporation | 57815782578357845785 | |
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Mfr.#: 904-27-1-21-2-B-0 OMO.#: OMO-904-27-1-21-2-B-0 |
Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 20.6mm Height, Aluminum, Black Anodized | Wakefield-Vette | 904 | |
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Mfr.#: 7-1542003-3 OMO.#: OMO-7-1542003-3 |
Heat Sinks 30.5MM LOW P HS ASS | TE Connectivity | None | |
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Mfr.#: 302NN OMO.#: OMO-302NN |
Heat Sinks Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x38.1mm, (2) 1 4 -28UNF, 0.625 Inch Thread Depth | Wakefield-Vette | 302 | |
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Mfr.#: ATS-51300K-C1-R0 OMO.#: OMO-ATS-51300K-C1-R0 |
Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 30x30x14.5mm, 53.3mm Fin Tip | Advanced Thermal Solutions | BGA Low Profile | |
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Mfr.#: 910-40-1-28-2-B-0 OMO.#: OMO-910-40-1-28-2-B-0 |
Heat Sinks Chipset Heatsink with Clip, Elliptical, 40mm Chip Size, 40.6mm Height, Aluminum, Black Anodized | Wakefield-Vette | 910 | |
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Mfr.#: 578405B00000G OMO.#: OMO-578405B00000G |
Heat Sinks Snap-On Cooler Heatsink for TO-5, Vertical Mounting, 31 n Thermal Resistance, Black Anodized, 19.05mm | Aavid, Thermal Division of Boyd Corporation | 57815782578357845785 | |
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Mfr.#: TXBE032031B OMO.#: OMO-TXBE032031B |
Heat Sinks TO-5 Solder Glue Adhesive mt. | CTS Electronic Components | TX | |
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Mfr.#: D057 OMO.#: OMO-D057 |
Heat Sinks BGA Solder Anchor, 2 Required | Aavid, Thermal Division of Boyd Corporation | BGA Solder Anchors | |
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Mfr.#: 303M OMO.#: OMO-303M |
Heat Sinks Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x76.2mm, (1) 10-32UNF, 0.625 Inch Thread Depth | Wakefield-Vette | 303 | |
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Mfr.#: ATS-51300D-C1-R0 OMO.#: OMO-ATS-51300D-C1-R0 |
Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 30x30x9.5mm, 43.2mm Fin Tip | Advanced Thermal Solutions | BGA Low Profile | |
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Mfr.#: 529902B00000 OMO.#: OMO-529902B00000 |
Heat Sinks | Aavid, Thermal Division of Boyd Corporation | None | |
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Mfr.#: 303N OMO.#: OMO-303N |
Heat Sinks Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x76.2mm, (1) 1 4 -28UNF, 0.625 Inch Thread Depth | Wakefield-Vette | 303 | |
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Mfr.#: ATS-51310D-C1-R0 OMO.#: OMO-ATS-51310D-C1-R0 |
Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 31x31x9.5mm, 44.4mm Fin Tip | Advanced Thermal Solutions | BGA Low Profile | |
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Mfr.#: 7721-13NG OMO.#: OMO-7721-13NG |
Heat Sinks Nylon Shoulder Washer, 5.89/6.05mm OD, 2.87/3.00mm ID | Aavid, Thermal Division of Boyd Corporation | 7721 | |
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Mfr.#: MGT230 OMO.#: OMO-MGT230 |
Heat Sinks maxiGRIP Tool Set for 23mm Components | Advanced Thermal Solutions | MGT | |
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Mfr.#: 908-35-1-28-2-B-0 OMO.#: OMO-908-35-1-28-2-B-0 |
Heat Sinks Chipset Heatsink with Clip, Elliptical, 35mm Chip Size, 35.6mm Height, Aluminum, Black Anodized | Wakefield-Vette | 908 | |
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Mfr.#: 580400B00000G OMO.#: OMO-580400B00000G |
Heat Sinks Slide-On Style Heatsink for DIPS, Staggered Fins, Horizontal Mounting, 39 n Thermal Resistance, Black Anodized, 17.78x28.58x14.12mm | Aavid, Thermal Division of Boyd Corporation | 5804 | |
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Mfr.#: 906-31-1-12-2-B-0 OMO.#: OMO-906-31-1-12-2-B-0 |
Heat Sinks Chipset Heatsink with Clip, Elliptical, 31mm Chip Size, 11.6mm Height, Aluminum, Black Anodized | Wakefield-Vette | 906 | |
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Mfr.#: ATS-50400B-C1-R0 OMO.#: OMO-ATS-50400B-C1-R0 |
Heat Sinks maxiFLOW Heatsink with maxiGRIP Attachment, Double-Sided Thermal Tape, Blue-Anodized, T412, 40x40x7.5mm | Advanced Thermal Solutions | ATS-50 | |
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Mfr.#: ATS-50230G-C1-R0 OMO.#: OMO-ATS-50230G-C1-R0 |
Heat Sinks maxiFLOW Heatsink with maxiGRIP Attachment, T766, Blue-Anodized, 23x23x12.5mm | Advanced Thermal Solutions | ATS-50 | |
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Mfr.#: 303MM OMO.#: OMO-303MM |
Heat Sinks Compact Heat Sink for Dual StudMounted Semiconductor Cases | Wakefield-Vette | None | |
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Mfr.#: ATS-51350R-C1-R0 OMO.#: OMO-ATS-51350R-C1-R0 |
Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 35x35x19.5mm, 61.3mm Fin Tip | Advanced Thermal Solutions | BGA Low Profile | |
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Mfr.#: 657-15ABPESC OMO.#: OMO-657-15ABPESC |
Heat Sinks High Performance Heat Sink for Vertical Board Mounting T0220, T0227, T0218 | Wakefield-Vette | None | |
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Mfr.#: 533502B02552G OMO.#: OMO-533502B02552G |
Heat Sinks Extruded Style Heatsink for TO-220, Large Radial Fins, Vertical Mounting, 4.5 n Thermal Resistance, Black Anodized, 2.67mm, Device Clip #52 Hole, 50.8x18.29mm | Aavid, Thermal Division of Boyd Corporation | 5334533553365337 | |
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Mfr.#: 568300B00000 OMO.#: OMO-568300B00000 |
Heat Sinks | Aavid, Thermal Division of Boyd Corporation | None | |
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Mfr.#: 139-5A OMO.#: OMO-139-5A |
Heat Sinks Compression Clamp Assemblies for Semicondutors to 3.50in. | Wakefield-Vette | None | |
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Mfr.#: D10650-40 OMO.#: OMO-D10650-40 |
Heat Sinks Deltem Composite Pin Fin Heatsink, 16.5x10.2mm | Wakefield-Vette | D10650-40 | |
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Mfr.#: 903-23-1-28-2-B-0 OMO.#: OMO-903-23-1-28-2-B-0 |
Heat Sinks Chipset Heatsink with Clip, Elliptical, 23mm Chip Size, 27.6mm Height, Aluminum, Black Anodized | Wakefield-Vette | 903 | |
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Mfr.#: 593002B00000G OMO.#: OMO-593002B00000G |
Heat Sinks Board Level Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, 12.7x29.98x25.4mm | Aavid, Thermal Division of Boyd Corporation | 5930 | |
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Mfr.#: 580500B00000G OMO.#: OMO-580500B00000G |
Heat Sinks Slide-On Style Heatsink for DIPS, Staggered Fins, Horizontal Mounting, 20 n Thermal Resistance, Black Anodized, 14.73x25.6x37.08mm | Aavid, Thermal Division of Boyd Corporation | 5805 | |
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Mfr.#: ATS-53190D-C1-R0 OMO.#: OMO-ATS-53190D-C1-R0 |
Heat Sinks maxiGRIP BGA Heatsink with Attachment, High Performance, Straight Fin, Low Profile, Black-Anodized, T766, 19x19x9.5mm | Advanced Thermal Solutions | BGA | |
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Mfr.#: 910-40-1-12-2-B-0 OMO.#: OMO-910-40-1-12-2-B-0 |
Heat Sinks Chipset Heatsink with Clip, Elliptical, 40mm Chip Size, 11.6mm Height, Aluminum, Black Anodized | Wakefield-Vette | 910 | |
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Mfr.#: 907-33-1-21-2-B-0 OMO.#: OMO-907-33-1-21-2-B-0 |
Heat Sinks Chipset Heatsink with Clip, Elliptical, 33mm Chip Size, 20.6mm Height, Aluminum, Black Anodized | Wakefield-Vette | 907 | |
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Mfr.#: ATS-1042-C2-R0 OMO.#: OMO-ATS-1042-C2-R0 |
Heat Sinks maxiFLOW BGA Heatsink with Plastic pushPIN, High Performance, Cross-Cut, 41x45x15mm | Advanced Thermal Solutions | BGA Cross-Cut | |
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Mfr.#: 625-60AB OMO.#: OMO-625-60AB |
Heat Sinks Omnidirectional Pin Fin Heatsink for 25mm BGA, 25x15.2mm | Wakefield-Vette | 625 | |
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Mfr.#: 628-25ABT5 OMO.#: OMO-628-25ABT5 |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 45mm BGA | Wakefield-Vette | None | |
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Mfr.#: 530001B00000 OMO.#: OMO-530001B00000 |
Heat Sinks | Aavid, Thermal Division of Boyd Corporation | None | |
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Mfr.#: ATS-50250G-C1-R0 OMO.#: OMO-ATS-50250G-C1-R0 |
Heat Sinks maxiFLOW Heatsink with maxiGRIP Attachment, T766, Blue-Anodized, 25x25x12.5mm | Advanced Thermal Solutions | ATS-50 | |
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Mfr.#: 642-35ABT4E OMO.#: OMO-642-35ABT4E |
Heat Sinks Unidirectional Fin Heat Sink for 35mm BGA | Wakefield-Vette | None | |
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Mfr.#: APF40-40-13CB OMO.#: OMO-APF40-40-13CB |
Heat Sinks 40x40x13mm | CTS Electronic Components | APF | |
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Mfr.#: 630-45ABT3 OMO.#: OMO-630-45ABT3 |
Heat Sinks Omnidirectional Pin Fin Heatsink for 35mm BGA, 35x10.2mm, Chomerics T412 | Wakefield-Vette | 630 | |
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Mfr.#: ATS-61310D-C1-R0 OMO.#: OMO-ATS-61310D-C1-R0 |
Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 30.25x30.25x9.5mm, 30.25mm dia. | Advanced Thermal Solutions | ATS-61 | |
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Mfr.#: 180-12-12SS OMO.#: OMO-180-12-12SS |
Heat Sinks Liquid Cold Plate for Rectifiers, Diodes, and Power Modules, Aluminum, Stainless Steel Tubing, 304.8x196.9x16.7mm, Single | Wakefield-Vette | 180 | |
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Mfr.#: ATS-61450D-C1-R0 OMO.#: OMO-ATS-61450D-C1-R0 |
Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, T412, Black-Anodized, 44.25x44.25x9.5mm, 44.25mm dia. | Advanced Thermal Solutions | ATS-61 | |
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Mfr.#: 8-1542003-1 OMO.#: OMO-8-1542003-1 |
Heat Sinks HTS656-U=23MM HS ASSY A-TEMP C | TE Connectivity | None | |
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Mfr.#: 642-35AB OMO.#: OMO-642-35AB |
Heat Sinks Unidirectional Fin Heatsink for 35mm BGA, 35x8.9mm | Wakefield-Vette | 642 |